Part Details for IS75V16F64GS16-7080DI by Integrated Silicon Solution Inc
Overview of IS75V16F64GS16-7080DI by Integrated Silicon Solution Inc
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Part Details for IS75V16F64GS16-7080DI
IS75V16F64GS16-7080DI CAD Models
IS75V16F64GS16-7080DI Part Data Attributes
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IS75V16F64GS16-7080DI
Integrated Silicon Solution Inc
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Datasheet
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IS75V16F64GS16-7080DI
Integrated Silicon Solution Inc
Memory Circuit, 4MX16, CMOS, PBGA65, 9 X 9 MM, 0.80 MM PITCH, FBGA-65
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Part Package Code | BGA | |
| Package Description | 9 X 9 MM, 0.80 MM PITCH, FBGA-65 | |
| Pin Count | 65 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Additional Feature | ALSO CONTAINS 16MBIT PSEUDO SRAM | |
| JESD-30 Code | S-PBGA-B65 | |
| JESD-609 Code | e0 | |
| Length | 9 mm | |
| Memory Density | 67108864 bit | |
| Memory IC Type | MEMORY CIRCUIT | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Terminals | 65 | |
| Number of Words | 4194304 words | |
| Number of Words Code | 4000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -30 °C | |
| Organization | 4MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.34 mm | |
| Supply Voltage-Max (Vsup) | 3.1 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 2.9 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 9 mm |