Part Details for IS22ES32G-JQLA1 by Integrated Silicon Solution Inc
Results Overview of IS22ES32G-JQLA1 by Integrated Silicon Solution Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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IS22ES32G-JQLA1 Information
IS22ES32G-JQLA1 by Integrated Silicon Solution Inc is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for IS22ES32G-JQLA1
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
IS22ES32G-JQLA1
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Avnet Silica | Flash Card 32Gbyte 33V Embedded MMC 100Pin LFBGA (Alt: IS22ES32G-JQLA1) RoHS: Compliant Min Qty: 1 Package Multiple: 1 | Silica - 0 |
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Buy Now | |
DISTI #
IS22ES32G-JQLA1
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EBV Elektronik | Flash Card 32Gbyte 33V Embedded MMC 100Pin LFBGA (Alt: IS22ES32G-JQLA1) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 53 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for IS22ES32G-JQLA1
IS22ES32G-JQLA1 CAD Models
IS22ES32G-JQLA1 Part Data Attributes
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IS22ES32G-JQLA1
Integrated Silicon Solution Inc
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Datasheet
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Compare Parts:
IS22ES32G-JQLA1
Integrated Silicon Solution Inc
Flash, 32GX8, PBGA100, FBGA-100
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
Package Description | FBGA-100 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Date Of Intro | 2016-09-13 | |
Samacsys Manufacturer | Integrated Silicon Solution Inc. | |
Alternate Memory Width | 1 | |
Clock Frequency-Max (fCLK) | 200 MHz | |
Command User Interface | NO | |
Data Polling | NO | |
JESD-30 Code | R-PBGA-B100 | |
JESD-609 Code | e1 | |
Length | 18 mm | |
Memory Density | 274877906944 bit | |
Memory IC Type | FLASH | |
Memory Width | 8 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 100 | |
Number of Words | 34359738368 words | |
Number of Words Code | 32000000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 32GX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA100,12X17,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Programming Voltage | 3.3 V | |
Screening Level | AEC-Q100 | |
Seated Height-Max | 1.4 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 10 | |
Toggle Bit | NO | |
Type | MLC NAND TYPE | |
Width | 14 mm |