Part Details for HYS64D16000GDL-6-B by Infineon Technologies AG
Overview of HYS64D16000GDL-6-B by Infineon Technologies AG
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (3 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Computing and Data Storage
Part Details for HYS64D16000GDL-6-B
HYS64D16000GDL-6-B CAD Models
HYS64D16000GDL-6-B Part Data Attributes:
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HYS64D16000GDL-6-B
Infineon Technologies AG
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Datasheet
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HYS64D16000GDL-6-B
Infineon Technologies AG
DDR DRAM Module, 16MX64, 0.7ns, CMOS, SODIMM-200
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Part Package Code | MODULE | |
Package Description | DIMM, DIMM200,24 | |
Pin Count | 200 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.32 | |
Access Mode | SINGLE BANK PAGE BURST | |
Access Time-Max | 0.7 ns | |
Additional Feature | AUTO/SELF REFRESH | |
Clock Frequency-Max (fCLK) | 166 MHz | |
I/O Type | COMMON | |
JESD-30 Code | R-XDMA-N200 | |
Memory Density | 1073741824 bit | |
Memory IC Type | DDR DRAM MODULE | |
Memory Width | 64 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 200 | |
Number of Words | 16777216 words | |
Number of Words Code | 16000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 16MX64 | |
Output Characteristics | 3-STATE | |
Package Body Material | UNSPECIFIED | |
Package Code | DIMM | |
Package Equivalence Code | DIMM200,24 | |
Package Shape | RECTANGULAR | |
Package Style | MICROELECTRONIC ASSEMBLY | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Refresh Cycles | 8192 | |
Self Refresh | YES | |
Supply Current-Max | 1.14 mA | |
Supply Voltage-Max (Vsup) | 2.7 V | |
Supply Voltage-Min (Vsup) | 2.3 V | |
Supply Voltage-Nom (Vsup) | 2.5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.6 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Alternate Parts for HYS64D16000GDL-6-B
This table gives cross-reference parts and alternative options found for HYS64D16000GDL-6-B. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HYS64D16000GDL-6-B, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
HYS64D16001HDL-6-B | DDR DRAM Module, 16MX64, 0.7ns, CMOS, SODIMM-200 | Infineon Technologies AG | HYS64D16000GDL-6-B vs HYS64D16001HDL-6-B |
HYS64D16001GDL-6-B | DDR DRAM Module, 16MX64, 0.7ns, CMOS, SODIMM-200 | Infineon Technologies AG | HYS64D16000GDL-6-B vs HYS64D16001GDL-6-B |
M470L1624FT0-LB3 | DDR DRAM Module, 16MX64, 0.7ns, CMOS, SODIMM-200 | Samsung Semiconductor | HYS64D16000GDL-6-B vs M470L1624FT0-LB3 |