Part Details for HYI18T1G800BC-3 by Qimonda AG
Overview of HYI18T1G800BC-3 by Qimonda AG
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (5 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for HYI18T1G800BC-3
HYI18T1G800BC-3 CAD Models
HYI18T1G800BC-3 Part Data Attributes
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HYI18T1G800BC-3
Qimonda AG
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Datasheet
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HYI18T1G800BC-3
Qimonda AG
DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA68, PLASTIC, TFBGA-68
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | QIMONDA AG | |
| Part Package Code | BGA | |
| Package Description | TFBGA, BGA68,9X19,32 | |
| Pin Count | 68 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.32 | |
| Access Mode | FOUR BANK PAGE BURST | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | AUTO/SELF REFRESH | |
| Clock Frequency-Max (fCLK) | 333 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 4,8 | |
| JESD-30 Code | R-PBGA-B68 | |
| Length | 17 mm | |
| Memory Density | 1073741824 bit | |
| Memory IC Type | DDR2 DRAM | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 68 | |
| Number of Words | 134217728 words | |
| Number of Words Code | 128000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA68,9X19,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Qualification Status | Not Qualified | |
| Refresh Cycles | 8192 | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 4,8 | |
| Supply Current-Max | 0.23 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 10 mm |
Alternate Parts for HYI18T1G800BC-3
This table gives cross-reference parts and alternative options found for HYI18T1G800BC-3. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HYI18T1G800BC-3, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| HYI18T1G800BC-3S | DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA68, PLASTIC, TFBGA-68 | Qimonda AG | HYI18T1G800BC-3 vs HYI18T1G800BC-3S |
| HYB18T1G800BF-3 | DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA68, GREEN, PLASTIC, TFBGA-68 | Qimonda AG | HYI18T1G800BC-3 vs HYB18T1G800BF-3 |
| HYB18T1G800BC-3S | DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA68, PLASTIC, TFBGA-68 | Qimonda AG | HYI18T1G800BC-3 vs HYB18T1G800BC-3S |
| HYB18T1G800BF-3S | DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA68, GREEN, PLASTIC, TFBGA-68 | Qimonda AG | HYI18T1G800BC-3 vs HYB18T1G800BF-3S |
| HYI18T1G800BF-3 | DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA68, GREEN, PLASTIC, TFBGA-68 | Qimonda AG | HYI18T1G800BC-3 vs HYI18T1G800BF-3 |