Part Details for HYB18L256160BF-7.5 by Qimonda AG
Overview of HYB18L256160BF-7.5 by Qimonda AG
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for HYB18L256160BF-7.5
| Part # | Distributor | Description | Stock | Price | Buy | |
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Chip1Cloud | 18000 |
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RFQ |
Part Details for HYB18L256160BF-7.5
HYB18L256160BF-7.5 CAD Models
HYB18L256160BF-7.5 Part Data Attributes
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HYB18L256160BF-7.5
Qimonda AG
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Datasheet
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HYB18L256160BF-7.5
Qimonda AG
Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54, 12 X 8 MM, 1 MM HEIGHT, GREEN, PLASTIC, VFBGA-54
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | QIMONDA AG | |
| Part Package Code | BGA | |
| Package Description | 12 X 8 MM, 1 MM HEIGHT, GREEN, PLASTIC, VFBGA-54 | |
| Pin Count | 54 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.24 | |
| Access Mode | FOUR BANK PAGE BURST | |
| Access Time-Max | 5.4 ns | |
| Additional Feature | AUTO/SELF REFRESH | |
| Clock Frequency-Max (fCLK) | 133 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 1,2,4,8 | |
| JESD-30 Code | R-PBGA-B54 | |
| Length | 12 mm | |
| Memory Density | 268435456 bit | |
| Memory IC Type | SYNCHRONOUS DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 54 | |
| Number of Words | 16777216 words | |
| Number of Words Code | 16000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 16MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA54,9X9,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Refresh Cycles | 8192 | |
| Self Refresh | YES | |
| Sequential Burst Length | 1,2,4,8,FP | |
| Standby Current-Max | 0.00035 A | |
| Supply Current-Max | 0.09 mA | |
| Supply Voltage-Max (Vsup) | 1.95 V | |
| Supply Voltage-Min (Vsup) | 1.65 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 8 mm |
Alternate Parts for HYB18L256160BF-7.5
This table gives cross-reference parts and alternative options found for HYB18L256160BF-7.5. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HYB18L256160BF-7.5, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| HYE18L256160BF-7.5 | Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54, 12 X 8 MM, 1 MM HEIGHT, GREEN, PLASTIC, VFBGA-54 | Qimonda AG | HYB18L256160BF-7.5 vs HYE18L256160BF-7.5 |
| HY5S5B6GLF-6 | Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54, 8 MM X 10 MM, 0.80 MM PITCH, FBGA-54 | SK Hynix Inc | HYB18L256160BF-7.5 vs HY5S5B6GLF-6 |
| IS42VS16160D-75BLI | Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54, 13 X 8 MM, 0.80 MM PITCH, LEAD FREE, MS-207, BGA-54 | Integrated Silicon Solution Inc | HYB18L256160BF-7.5 vs IS42VS16160D-75BLI |
| IS42VS16160D-75BL | Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54, 13 X 8 MM, 0.80 MM PITCH, LEAD FREE, MS-207, BGA-54 | Integrated Silicon Solution Inc | HYB18L256160BF-7.5 vs IS42VS16160D-75BL |
| HY5S5B6GLFP-6 | Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54, 8 MM X 10 MM, 0.80 MM PITCH, LEAD FREE, FBGA-54 | SK Hynix Inc | HYB18L256160BF-7.5 vs HY5S5B6GLFP-6 |
| H55S2562JFR-75M | Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54, 8 X 8 MM, 1 MM HEIGHT, 0.80 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-54 | SK Hynix Inc | HYB18L256160BF-7.5 vs H55S2562JFR-75M |
| MT48H16M16LFBF-75IT:H | Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54, 8 X 9 MM, GREEN, PLASTIC, VFBGA-54 | Micron Technology Inc | HYB18L256160BF-7.5 vs MT48H16M16LFBF-75IT:H |
| HYE18L256169BF-7.5 | Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54, 11 X 8 MM, 1 MM HEIGHT, GREEN, PLASTIC, VFBGA-54 | Qimonda AG | HYB18L256160BF-7.5 vs HYE18L256169BF-7.5 |
| HYE18L256169BFX-7.5 | Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54, 11 X 8 MM, 1 MM HEIGHT, GREEN, PLASTIC, VFBGA-54 | Qimonda AG | HYB18L256160BF-7.5 vs HYE18L256169BFX-7.5 |
| MT48H16M16LFBF-75IT:G | Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54, 8 X 9 MM, GREEN, PLASTIC, VFBGA-54 | Micron Technology Inc | HYB18L256160BF-7.5 vs MT48H16M16LFBF-75IT:G |