HY5DU56822CLTP-L
SK Hynix Inc
Description: DDR DRAM, 32MX8, CMOS, PDSO66,

Overview of HY5DU56822CLTP-L by SK Hynix Inc

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Where used in Applications: Consumer Electronics Computing and Data Storage

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Part Data Attributes for HY5DU56822CLTP-L by SK Hynix Inc

HY5DU56822CLTP-L
SK Hynix Inc
-
-
Part Life Cycle Code
Obsolete
Ihs Manufacturer
SK HYNIX INC
Package Description
TSSOP, TSSOP66,.46
Reach Compliance Code
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.24
Clock Frequency-Max (fCLK)
125 MHz
I/O Type
COMMON
Interleaved Burst Length
2,4,8
JESD-30 Code
R-PDSO-G66
Memory Density
268435456 bit
Memory IC Type
DDR1 DRAM
Memory Width
8
Number of Terminals
66
Number of Words
33554432 words
Number of Words Code
32000000
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
32MX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
TSSOP
Package Equivalence Code
TSSOP66,.46
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status
Not Qualified
Refresh Cycles
8192
Sequential Burst Length
2,4,8
Standby Current-Max
0.01 A
Supply Current-Max
0.24 mA
Supply Voltage-Nom (Vsup)
2.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
GULL WING
Terminal Pitch
0.635 mm
Terminal Position
DUAL
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  1. HY5DU56822CLTP-L
    SK Hynix Inc
    DDR DRAM, 32MX8, CMOS, PDSO66,
    VS

Alternate Parts for HY5DU56822CLTP-L

This table gives cross-reference parts and alternative options found for HY5DU56822CLTP-L. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HY5DU56822CLTP-L, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
HY5DU56822DLTP-L DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 SK Hynix Inc HY5DU56822CLTP-L vs HY5DU56822DLTP-L
HY5DU56822CT-L DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 SK Hynix Inc HY5DU56822CLTP-L vs HY5DU56822CT-L
HY5DU56822CLT-L DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 SK Hynix Inc HY5DU56822CLTP-L vs HY5DU56822CLT-L
Part Number Description Manufacturer Compare
MT46V32M8P-75ZIT DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-66 Micron Technology Inc HY5DU56822CLTP-L vs MT46V32M8P-75ZIT
IBMN625805GT3B-75N DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP2-66 IBM HY5DU56822CLTP-L vs IBMN625805GT3B-75N
MT46V32M8TC-5B:G DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-66 Micron Technology Inc HY5DU56822CLTP-L vs MT46V32M8TC-5B:G
HY5DU56822DT-H DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 SK Hynix Inc HY5DU56822CLTP-L vs HY5DU56822DT-H
V58C2256804SXT75 DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, PLASTIC, TSOP2-66 Mosel Vitelic Corporation HY5DU56822CLTP-L vs V58C2256804SXT75
MT46V32M8BJ-75L DDR DRAM, 32MX8, 0.75ns, CMOS, PBGA60, 16 X 9 MM, PLASTIC, FBGA-60 Micron Technology Inc HY5DU56822CLTP-L vs MT46V32M8BJ-75L
MT46V32M8BG-75ZLH DDR DRAM, 32MX8, 0.75ns, CMOS, PBGA60, 14 X 8 MM, PLASTIC, FBGA-60 Micron Technology Inc HY5DU56822CLTP-L vs MT46V32M8BG-75ZLH
M2S56D30TP-75 DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 Mitsubishi Electric HY5DU56822CLTP-L vs M2S56D30TP-75
HY5DU56822DLTP-L DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 SK Hynix Inc HY5DU56822CLTP-L vs HY5DU56822DLTP-L
IBMN625804GT3B-7N DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP2-66 IBM HY5DU56822CLTP-L vs IBMN625804GT3B-7N

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