Part Details for HSDL-3612-038 by Broadcom Limited
Overview of HSDL-3612-038 by Broadcom Limited
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| UPD70F3612M2GBA2-GAH-AX | Renesas Electronics Corporation | 32-bit Microcontrollers (Non Promotion) | |
| UPD70F3612M2GBA1-GAH-AX | Renesas Electronics Corporation | 32-bit Microcontrollers (Non Promotion) | |
| 72T36125L5BB | Renesas Electronics Corporation | 256K x 36 TeraSync FIFO, 2.5V |
Part Details for HSDL-3612-038
HSDL-3612-038 CAD Models
HSDL-3612-038 Part Data Attributes
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HSDL-3612-038
Broadcom Limited
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HSDL-3612-038
Broadcom Limited
Interface Circuit, BICMOS
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | BROADCOM LTD | |
| Package Description | , | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Interface IC Type | INTERFACE CIRCUIT | |
| JESD-30 Code | R-XSMA-N10 | |
| Moisture Sensitivity Level | 4 | |
| Number of Functions | 1 | |
| Number of Terminals | 10 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | -20 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | SMA | |
| Package Shape | RECTANGULAR | |
| Package Style | MICROELECTRONIC ASSEMBLY | |
| Peak Reflow Temperature (Cel) | 255 | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 2.7 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | NO | |
| Technology | BICMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | NO LEAD | |
| Terminal Position | SINGLE |