Part Details for HN27C4096G-12 by Hitachi Ltd
Overview of HN27C4096G-12 by Hitachi Ltd
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Computing and Data Storage
Financial Technology (Fintech)
Healthcare
Telecommunications
Renewable Energy
Robotics and Drones
Price & Stock for HN27C4096G-12
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
|
Quest Components | EPROM, 256K x 16, 40 Pin, Ceramic, DIP | 7 |
|
$28.8000 | Buy Now |
Part Details for HN27C4096G-12
HN27C4096G-12 CAD Models
HN27C4096G-12 Part Data Attributes
|
|
HN27C4096G-12
Hitachi Ltd
Buy Now
Datasheet
|
Compare Parts:
HN27C4096G-12
Hitachi Ltd
UVPROM, 256KX16, 120ns, CMOS, CDIP40, CERDIP-40
|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | HITACHI LTD | |
| Part Package Code | DIP | |
| Package Description | WDIP, DIP40,.6 | |
| Pin Count | 40 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 120 ns | |
| Additional Feature | PAGE WRITE | |
| I/O Type | COMMON | |
| JESD-30 Code | R-GDIP-T40 | |
| JESD-609 Code | e0 | |
| Length | 52.07 mm | |
| Memory Density | 4194304 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Terminals | 40 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 256KX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | WDIP | |
| Package Equivalence Code | DIP40,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 6.3 mm | |
| Standby Current-Max | 0.00002 A | |
| Supply Current-Max | 0.1 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for HN27C4096G-12
This table gives cross-reference parts and alternative options found for HN27C4096G-12. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HN27C4096G-12, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| M27C4002-12XB6TR | 256KX16 UVPROM, 120ns, PDIP40, 0.600 INCH, LEAD FREE, PLASTIC, DIP-40 | STMicroelectronics | HN27C4096G-12 vs M27C4002-12XB6TR |
| HN27C4096AG-12 | 256KX16 UVPROM, 120ns, CDIP40, 0.600 INCH, CERDIP-40 | Renesas Electronics Corporation | HN27C4096G-12 vs HN27C4096AG-12 |
| AM27C4096-125DE | UVPROM, 256KX16, 120ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 | AMD | HN27C4096G-12 vs AM27C4096-125DE |
| M27C4002-12B6TR | 256KX16 UVPROM, 120ns, PDIP40, 0.600 INCH, LEAD FREE, PLASTIC, DIP-40 | STMicroelectronics | HN27C4096G-12 vs M27C4002-12B6TR |
| AM27C4096-120DCB | UVPROM, 256KX16, 120ns, CMOS, CDIP40, CERAMIC, DIP-40 | Spansion | HN27C4096G-12 vs AM27C4096-120DCB |
| M27C4002-12XF6TR | 256KX16 UVPROM, 120ns, CDIP40, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-40 | STMicroelectronics | HN27C4096G-12 vs M27C4002-12XF6TR |
| AM27C4096-120/BXA | UVPROM, 256KX16, 120ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 | AMD | HN27C4096G-12 vs AM27C4096-120/BXA |
| AM27C4096-120DC | UVPROM, 256KX16, 120ns, CMOS, CDIP40, CERAMIC, DIP-40 | Spansion | HN27C4096G-12 vs AM27C4096-120DC |
| AM27C4096-125DEB | UVPROM, 256KX16, 120ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 | AMD | HN27C4096G-12 vs AM27C4096-125DEB |
| TMS27C240-120JL4 | 256KX16 UVPROM, 120ns, CDIP40, 0.600 INCH, WINDOWED, CERAMIC, DIP-40 | Texas Instruments | HN27C4096G-12 vs TMS27C240-120JL4 |