Datasheets
HM66AEB9405BP-50 by: Renesas Electronics Corporation

4MX9 DDR SRAM, 0.45ns, PBGA165, PLASTIC, FBGA-165

Part Details for HM66AEB9405BP-50 by Renesas Electronics Corporation

Overview of HM66AEB9405BP-50 by Renesas Electronics Corporation

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Applications Space Technology Environmental Monitoring Internet of Things (IoT) Smart Cities Agriculture Technology Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Medical Imaging Consumer Electronics Education and Research Security and Surveillance Aerospace and Defense Healthcare Robotics and Drones

Part Details for HM66AEB9405BP-50

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HM66AEB9405BP-50 Part Data Attributes:

HM66AEB9405BP-50 Renesas Electronics Corporation
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HM66AEB9405BP-50 Renesas Electronics Corporation 4MX9 DDR SRAM, 0.45ns, PBGA165, PLASTIC, FBGA-165
Part Life Cycle Code Obsolete
Ihs Manufacturer RENESAS TECHNOLOGY CORP
Part Package Code BGA
Package Description LBGA, BGA165,11X15,40
Pin Count 165
Reach Compliance Code unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 0.45 ns
Clock Frequency-Max (fCLK) 200 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165
JESD-609 Code e1
Length 17 mm
Memory Density 37748736 bit
Memory IC Type DDR SRAM
Memory Width 9
Number of Functions 1
Number of Terminals 165
Number of Words 4194304 words
Number of Words Code 4000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 4MX9
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 1.46 mm
Standby Current-Max 0.28 A
Standby Voltage-Min 1.7 V
Supply Current-Max 0.62 mA
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 15 mm

Alternate Parts for HM66AEB9405BP-50

This table gives cross-reference parts and alternative options found for HM66AEB9405BP-50. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HM66AEB9405BP-50, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
CY7C1429AV18-200BZC DDR SRAM, 4MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor HM66AEB9405BP-50 vs CY7C1429AV18-200BZC
GS8342S09AGE-200I DDR SRAM, 4MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, MO-216CAB-1, FPBGA-165 GSI Technology HM66AEB9405BP-50 vs GS8342S09AGE-200I
GS8342S09AE-200I DDR SRAM, 4MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, MO-216CAB-1, FPBGA-165 GSI Technology HM66AEB9405BP-50 vs GS8342S09AE-200I
CY7C1429AV18-200BZI DDR SRAM, 4MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor HM66AEB9405BP-50 vs CY7C1429AV18-200BZI
GS8342S09AGE-200T DDR SRAM, 4MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, MO-216CAB-1, FPBGA-165 GSI Technology HM66AEB9405BP-50 vs GS8342S09AGE-200T
GS8342S09AE-200 DDR SRAM, 4MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, MO-216CAB-1, FPBGA-165 GSI Technology HM66AEB9405BP-50 vs GS8342S09AE-200
CY7C1429AV18-200BZXC DDR SRAM, 4MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor HM66AEB9405BP-50 vs CY7C1429AV18-200BZXC
GS8342S09AGE-200IT DDR SRAM, 4MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, MO-216CAB-1, FPBGA-165 GSI Technology HM66AEB9405BP-50 vs GS8342S09AGE-200IT
UPD44324095F5-E50Y-EQ2-A DDR SRAM, 4MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, LEAD FREE, PLASTIC, FBGA-165 NEC Electronics Group HM66AEB9405BP-50 vs UPD44324095F5-E50Y-EQ2-A
UPD44324095F5-E50Y-EQ2 DDR SRAM, 4MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, PLASTIC, FBGA-165 NEC Electronics Group HM66AEB9405BP-50 vs UPD44324095F5-E50Y-EQ2
Part Number Description Manufacturer Compare
CY7C1429AV18-200BZC DDR SRAM, 4MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor HM66AEB9405BP-50 vs CY7C1429AV18-200BZC
UPD44324095F5-E50Y-EQ2 DDR SRAM, 4MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, PLASTIC, FBGA-165 NEC Electronics Group HM66AEB9405BP-50 vs UPD44324095F5-E50Y-EQ2
GS8342S09AGE-200I DDR SRAM, 4MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, MO-216CAB-1, FPBGA-165 GSI Technology HM66AEB9405BP-50 vs GS8342S09AGE-200I
GS8342S09AE-200 DDR SRAM, 4MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, MO-216CAB-1, FPBGA-165 GSI Technology HM66AEB9405BP-50 vs GS8342S09AE-200
CY7C1429BV18-200BZI DDR SRAM, 4MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor HM66AEB9405BP-50 vs CY7C1429BV18-200BZI
CY7C1429BV18-200BZC DDR SRAM, 4MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor HM66AEB9405BP-50 vs CY7C1429BV18-200BZC
UPD44324095F5-E50-EQ2 DDR SRAM, 4MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, PLASTIC, FBGA-165 NEC Electronics Group HM66AEB9405BP-50 vs UPD44324095F5-E50-EQ2
CY7C1429AV18-200BZXC DDR SRAM, 4MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor HM66AEB9405BP-50 vs CY7C1429AV18-200BZXC
GS8342S09AGE-200IT DDR SRAM, 4MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, MO-216CAB-1, FPBGA-165 GSI Technology HM66AEB9405BP-50 vs GS8342S09AGE-200IT
CY7C1429AV18-200BZI DDR SRAM, 4MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor HM66AEB9405BP-50 vs CY7C1429AV18-200BZI

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