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32-bit Microcontrollers, LFBGA, /
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Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
HD6417727BP100CV-ND
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DigiKey | IC MCU 32BIT ROMLESS 240LFBGA Lead time: 36 Weeks Container: Tray | Temporarily Out of Stock |
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HD6417727BP100CV
Renesas Electronics Corporation
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Datasheet
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HD6417727BP100CV
Renesas Electronics Corporation
32-bit Microcontrollers, LFBGA, /
|
Pbfree Code | Yes | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Part Package Code | LFBGA | |
Package Description | FBGA, BGA240,19X19,25 | |
Pin Count | 240 | |
Manufacturer Package Code | PLBG0240JA | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | Renesas Electronics | |
Address Bus Width | 26 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 50 MHz | |
External Data Bus Width | 32 | |
Format | FIXED POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-PBGA-B240 | |
Length | 13 mm | |
Low Power Mode | YES | |
Number of DMA Channels | 4 | |
Number of External Interrupts | 6 | |
Number of Serial I/Os | 3 | |
Number of Terminals | 240 | |
On Chip Data RAM Width | 8 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | -20 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA240,19X19,25 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Qualification Status | Not Qualified | |
RAM (words) | 16384 | |
Seated Height-Max | 1.4 mm | |
Speed | 100 MHz | |
Supply Current-Max | 450 mA | |
Supply Voltage-Max | 2.05 V | |
Supply Voltage-Min | 1.6 V | |
Supply Voltage-Nom | 1.9 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.65 mm | |
Terminal Position | BOTTOM | |
Width | 13 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |