Datasheets
HCD66108BP by:

Liquid Crystal Driver, 165-Segment, CMOS, 8.30 X 6.02 MM, GOLD BUMP, DIE-208

Part Details for HCD66108BP by Hitachi Ltd

Overview of HCD66108BP by Hitachi Ltd

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Part Details for HCD66108BP

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HCD66108BP Part Data Attributes

HCD66108BP Hitachi Ltd
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HCD66108BP Hitachi Ltd Liquid Crystal Driver, 165-Segment, CMOS, 8.30 X 6.02 MM, GOLD BUMP, DIE-208
Part Life Cycle Code Transferred
Ihs Manufacturer HITACHI LTD
Part Package Code DIE
Package Description DIE,
Pin Count 208
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
Display Mode DOT MATRIX
Interface IC Type LIQUID CRYSTAL DISPLAY DRIVER
JESD-30 Code R-XUUC-N208
Multiplexed Display Capability YES
Number of Functions 1
Number of Segments 165
Number of Terminals 208
Operating Temperature-Max 75 °C
Operating Temperature-Min -20 °C
Package Body Material UNSPECIFIED
Package Code DIE
Package Shape RECTANGULAR
Package Style UNCASED CHIP
Qualification Status Not Qualified
Supply Voltage-Max 6 V
Supply Voltage-Min 4 V
Supply Voltage-Nom 5 V
Supply Voltage1-Max 15 V
Supply Voltage1-Min 6 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL EXTENDED
Terminal Form NO LEAD
Terminal Position UPPER
fmax-Min 0.585 MHz

Alternate Parts for HCD66108BP

This table gives cross-reference parts and alternative options found for HCD66108BP. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HCD66108BP, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
HCD66108BP LIQUID CRYSTAL DISPLAY DRIVER, UUC208, 8.30 X 6.02 MM, GOLD BUMP, DIE-208 Renesas Electronics Corporation HCD66108BP vs HCD66108BP
Part Number Description Manufacturer Compare
HCD66108BP LIQUID CRYSTAL DISPLAY DRIVER, UUC208, 8.30 X 6.02 MM, GOLD BUMP, DIE-208 Renesas Electronics Corporation HCD66108BP vs HCD66108BP

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