Datasheets
H5TQ2G43AMP-G8C by: SK Hynix Inc

DDR DRAM, 256MX4, 0.3ns, CMOS, PBGA78, FBGA-78

Part Details for H5TQ2G43AMP-G8C by SK Hynix Inc

Overview of H5TQ2G43AMP-G8C by SK Hynix Inc

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Applications Consumer Electronics

Part Details for H5TQ2G43AMP-G8C

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H5TQ2G43AMP-G8C Part Data Attributes

H5TQ2G43AMP-G8C SK Hynix Inc
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H5TQ2G43AMP-G8C SK Hynix Inc DDR DRAM, 256MX4, 0.3ns, CMOS, PBGA78, FBGA-78
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SK HYNIX INC
Part Package Code BGA
Package Description LFBGA, BGA78,9X13,32
Pin Count 78
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.32
Access Mode MULTI BANK PAGE BURST
Access Time-Max 0.3 ns
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 533 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B78
JESD-609 Code e1
Length 11.6 mm
Memory Density 1073741824 bit
Memory IC Type DDR3 DRAM
Memory Width 4
Number of Functions 1
Number of Ports 1
Number of Terminals 78
Number of Words 268435456 words
Number of Words Code 256000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 256MX4
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA78,9X13,32
Package Shape RECTANGULAR
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Refresh Cycles 8192
Seated Height-Max 1.35 mm
Self Refresh YES
Standby Current-Max 0.02 A
Supply Current-Max 0.32 mA
Supply Voltage-Max (Vsup) 1.575 V
Supply Voltage-Min (Vsup) 1.425 V
Supply Voltage-Nom (Vsup) 1.5 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 8.4 mm

Alternate Parts for H5TQ2G43AMP-G8C

This table gives cross-reference parts and alternative options found for H5TQ2G43AMP-G8C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of H5TQ2G43AMP-G8C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
IDSH1G-02A1F1C-10F DDR DRAM, 256MX4, 20ns, CMOS, PBGA78, GREEN, PLASTIC, TFBGA-78 Qimonda AG H5TQ2G43AMP-G8C vs IDSH1G-02A1F1C-10F
MT41J512M4THR-15:D DDR DRAM, 256MX4, CMOS, PBGA78, 9 X 11.50 MM, LEAD FREE, FBGA-78 Micron Technology Inc H5TQ2G43AMP-G8C vs MT41J512M4THR-15:D
MT41K256M4JP-15E:F DDR DRAM, 256MX4, CMOS, PBGA78, 8 X 11.50 MM, LEAD FREE, FBGA-78 Micron Technology Inc H5TQ2G43AMP-G8C vs MT41K256M4JP-15E:F
K4B1G0446G-BCF80 DDR DRAM, 256MX4, 0.3ns, CMOS, PBGA78, HALOGEN FREE AND ROHS COMPLIANT, FBGA-78 Samsung Semiconductor H5TQ2G43AMP-G8C vs K4B1G0446G-BCF80
MT41J256M4JP-15IT:F DDR DRAM, 256MX4, CMOS, PBGA78, 8 X 11.50 MM, LEAD FREE, FBGA-78 Micron Technology Inc H5TQ2G43AMP-G8C vs MT41J256M4JP-15IT:F
MT41J256M4HX-125FIT:D DDR DRAM, 256MX4, CMOS, PBGA78, 9 X 11.50 MM, LEAD FREE, FBGA-78 Micron Technology Inc H5TQ2G43AMP-G8C vs MT41J256M4HX-125FIT:D
K4B2G0446C-HCF80 DDR DRAM, 512MX4, 0.3ns, CMOS, PBGA78, HALOGEN FREE AND ROHS COMPLIANT, FBGA-78 Samsung Semiconductor H5TQ2G43AMP-G8C vs K4B2G0446C-HCF80
K4B2G0446B-HCK00 DDR DRAM, 512MX4, 0.225ns, CMOS, PBGA78, HALOGEN FREE AND ROHS COMPLIANT, FBGA-78 Samsung Semiconductor H5TQ2G43AMP-G8C vs K4B2G0446B-HCK00
MT41J512M14DA-107:H DDR DRAM, 512MX4, CMOS, PBGA78, 8 X 10.50 MM, LEAD FREE, FBGA-78 Micron Technology Inc H5TQ2G43AMP-G8C vs MT41J512M14DA-107:H
MT41K512M4DA-125IT:K DDR DRAM, 512MX4, CMOS, PBGA78, FBGA-78 Micron Technology Inc H5TQ2G43AMP-G8C vs MT41K512M4DA-125IT:K

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