Part Details for GX1-266B-85-1.8 by National Semiconductor Corporation
Overview of GX1-266B-85-1.8 by National Semiconductor Corporation
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| R5S77630AY266BGV | Renesas Electronics Corporation | 32-bit Microcontrollers (Non Promotion), , / | |
| R8A77220AC266BG#U0 | Renesas Electronics Corporation | 32-bit Microcontrollers | |
| R8A77220AC266BAV | Renesas Electronics Corporation | 32-bit Microcontrollers |
Price & Stock for GX1-266B-85-1.8
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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Quest Components | MICROPROCESSOR, 32-BIT, 266MHZ, CMOS, PBGA352 | 68 |
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$30.1875 / $34.1250 | Buy Now |
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NexGen Digital | 24 |
|
RFQ |
Part Details for GX1-266B-85-1.8
GX1-266B-85-1.8 CAD Models
GX1-266B-85-1.8 Part Data Attributes
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GX1-266B-85-1.8
National Semiconductor Corporation
Buy Now
Datasheet
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Compare Parts:
GX1-266B-85-1.8
National Semiconductor Corporation
Microprocessor, 32-Bit, 266MHz, CMOS, PBGA352
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
| Package Description | BGA-352 | |
| Reach Compliance Code | not_compliant | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 33 MHz | |
| External Data Bus Width | 32 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B352 | |
| JESD-609 Code | e0 | |
| Length | 35 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 352 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 220 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.23 mm | |
| Speed | 266 MHz | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 35 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR |