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Microcontrollers and Processors / Microprocessors / GX1-266B-85-1.8
Datasheets
GX1-266B-85-1.8 by:
National Semiconductor Corporation
AMD
National Semiconductor Corporation
Rochester Electronics LLC
Texas Instruments
Not Found

Microprocessor, 32-Bit, 266MHz, CMOS, PBGA352

Part Details for GX1-266B-85-1.8 by National Semiconductor Corporation

Results Overview of GX1-266B-85-1.8 by National Semiconductor Corporation

Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

Applications Industrial Automation Renewable Energy Robotics and Drones

GX1-266B-85-1.8 Information

GX1-266B-85-1.8 by National Semiconductor Corporation is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Price & Stock for GX1-266B-85-1.8

Part # Distributor Description Stock Price Buy
Quest Components MICROPROCESSOR, 32-BIT, 266MHZ, CMOS, PBGA352 68
  • 1 $34.1250
  • 31 $31.5000
  • 64 $30.1875
$30.1875 / $34.1250 Buy Now
NexGen Digital   24
RFQ

Part Details for GX1-266B-85-1.8

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GX1-266B-85-1.8 Part Data Attributes

Parametric Data
GX1-266B-85-1.8 National Semiconductor Corporation
Buy Now Datasheet
Compare Parts:
GX1-266B-85-1.8 National Semiconductor Corporation Microprocessor, 32-Bit, 266MHz, CMOS, PBGA352
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Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP
Package Description BGA-352
Reach Compliance Code not_compliant
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 33 MHz
External Data Bus Width 32
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B352
JESD-609 Code e0
Length 35 mm
Low Power Mode YES
Moisture Sensitivity Level 3
Number of Terminals 352
Operating Temperature-Max 85 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA352,26X26,50
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 220
Qualification Status Not Qualified
Seated Height-Max 2.23 mm
Speed 266 MHz
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
Supply Voltage-Nom 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 35 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR

Alternate Parts for GX1-266B-85-1.8

This table gives cross-reference parts and alternative options found for GX1-266B-85-1.8. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GX1-266B-85-1.8, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
GX1-200B-85-1.6 Texas Instruments Check for Price 32-BIT, 200MHz, MICROPROCESSOR, PBGA352, BGA-352 GX1-266B-85-1.8 vs GX1-200B-85-1.6
GX1-200B-85-1.6 National Semiconductor Corporation Check for Price Microprocessor, 32-Bit, 200MHz, CMOS, PBGA352 GX1-266B-85-1.8 vs GX1-200B-85-1.6
GX1-266B-85-1.8 Texas Instruments Check for Price 32-BIT, 266MHz, MICROPROCESSOR, PBGA352, BGA-352 GX1-266B-85-1.8 vs GX1-266B-85-1.8
GX1-300B-85-2.0 National Semiconductor Corporation Check for Price Microprocessor, 32-Bit, 300MHz, CMOS, PBGA352 GX1-266B-85-1.8 vs GX1-300B-85-2.0
Part Number Manufacturer Composite Price Description Compare
GX1-200B-85-1.8 National Semiconductor Corporation Check for Price Microprocessor, 32-Bit, 200MHz, CMOS, PBGA352 GX1-266B-85-1.8 vs GX1-200B-85-1.8
GX1-200B-85-1.8 AMD Check for Price Microprocessor, 32-Bit, 200MHz, CMOS, PBGA352, EBGA-352 GX1-266B-85-1.8 vs GX1-200B-85-1.8
GXLV-266B2.9V70C Texas Instruments Check for Price 32-BIT, 266MHz, MICROPROCESSOR, PBGA352, BGA-352 GX1-266B-85-1.8 vs GXLV-266B2.9V70C
XPC8245LZU300LB Motorola Mobility LLC Check for Price 32-BIT, 300 MHz, RISC PROCESSOR, PBGA352, 35 X 35 MM, PLASTIC, TBGA-352 GX1-266B-85-1.8 vs XPC8245LZU300LB
XPC8240LZU200B Motorola Mobility LLC Check for Price 32-BIT, 200MHz, RISC PROCESSOR, PBGA352, 35 X 35 MM, CAVITY-DOWN, TBGA-352 GX1-266B-85-1.8 vs XPC8240LZU200B
MPC8245LZU266X Motorola Mobility LLC Check for Price 32-BIT, 266MHz, RISC PROCESSOR, PBGA352, 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, CAVITY DOWN, TBGA-352 GX1-266B-85-1.8 vs MPC8245LZU266X
XPC8245LZU266D Motorola Semiconductor Products Check for Price RISC Microprocessor, 32-Bit, 266MHz, CMOS, PBGA352, TBGA-352 GX1-266B-85-1.8 vs XPC8245LZU266D
MPC8245TVV266D NXP Semiconductors $101.6455 32-BIT, 266MHz, RISC PROCESSOR, PBGA352 GX1-266B-85-1.8 vs MPC8245TVV266D
PCX8240VTPU200C Teledyne e2v Check for Price RISC Microprocessor, 32-Bit, 200MHz, CMOS, PBGA352, 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, TBGA-352 GX1-266B-85-1.8 vs PCX8240VTPU200C
GXM-233B2.9V85C Texas Instruments Check for Price 32-BIT, 233MHz, MICROPROCESSOR, PBGA352, BGA-352 GX1-266B-85-1.8 vs GXM-233B2.9V85C

GX1-266B-85-1.8 Related Parts

GX1-266B-85-1.8 Frequently Asked Questions (FAQ)

  • The recommended operating temperature range for GX1-266B-85-1.8 is -40°C to 85°C.

  • To ensure proper biasing, follow the recommended voltage and current settings outlined in the datasheet, and ensure the input and output capacitors are properly selected and placed.

  • The maximum input voltage for the GX1-266B-85-1.8 is 1.8V, as specified in the datasheet.

  • Yes, the GX1-266B-85-1.8 is designed for high-frequency applications up to 266 MHz, but ensure proper layout, decoupling, and termination to minimize signal degradation and noise.

  • To troubleshoot issues, check the power supply, input and output connections, and ensure proper decoupling and termination. Also, verify that the device is operated within the recommended specifications and that the layout is optimized for high-frequency operation.