Datasheets
FPF2701MX by:
Fairchild Semiconductor Corporation
Fairchild Semiconductor Corporation
onsemi
Rochester Electronics LLC
Not Found

Buffer/Inverter Based Peripheral Driver, 1 Driver, 0.4A, PDSO8, HALOGEN AND LEAD FREE, MS-012AA, SOP-8

Part Details for FPF2701MX by Fairchild Semiconductor Corporation

Results Overview of FPF2701MX by Fairchild Semiconductor Corporation

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FPF2701MX Information

FPF2701MX by Fairchild Semiconductor Corporation is a Peripheral Driver.
Peripheral Drivers are under the broader part category of Drivers And Interfaces.

A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.

Price & Stock for FPF2701MX

Part # Distributor Description Stock Price Buy
Chip Stock   7500
RFQ
Vyrian Interface ICs 83835
RFQ

Part Details for FPF2701MX

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FPF2701MX Part Data Attributes

FPF2701MX Fairchild Semiconductor Corporation
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FPF2701MX Fairchild Semiconductor Corporation Buffer/Inverter Based Peripheral Driver, 1 Driver, 0.4A, PDSO8, HALOGEN AND LEAD FREE, MS-012AA, SOP-8
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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer FAIRCHILD SEMICONDUCTOR CORP
Part Package Code SOIC
Package Description HALOGEN AND LEAD FREE, MS-012AA, SOP-8
Pin Count 8
Manufacturer Package Code 8LD, SOIC,JEDEC MS-012, .150" NARROW BODY
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Built-in Protections OVER CURRENT; THERMAL; UNDER VOLTAGE
Driver Number of Bits 1
Interface IC Type BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 Code R-PDSO-G8
JESD-609 Code e3
Length 4.9 mm
Moisture Sensitivity Level 1
Number of Functions 1
Number of Terminals 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Output Current Flow Direction SOURCE
Output Peak Current Limit-Nom 0.4 A
Package Body Material PLASTIC/EPOXY
Package Code SOP
Package Equivalence Code SOP8,.25
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.75 mm
Supply Voltage-Max 36 V
Supply Voltage-Min 2.8 V
Supply Voltage-Nom 12 V
Surface Mount YES
Temperature Grade INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm

Alternate Parts for FPF2701MX

This table gives cross-reference parts and alternative options found for FPF2701MX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of FPF2701MX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
FPF2701MPX Fairchild Semiconductor Corporation Check for Price Buffer/Inverter Based Peripheral Driver, 1 Driver, 0.4A, PDSO8, 3 X 3 MM, HALOGEN AND LEAD FREE, MO-229, MLP-8 FPF2701MX vs FPF2701MPX

FPF2701MX Related Parts

FPF2701MX Frequently Asked Questions (FAQ)

  • The maximum operating temperature range for the FPF2701MX is -40°C to 125°C.

  • To ensure proper biasing, connect the VIN pin to a stable voltage source, and decouple the input with a 1uF capacitor. Also, ensure the EN pin is tied to a logic high or low depending on the desired state.

  • For optimal performance, place the FPF2701MX close to the power source, and use a solid ground plane to minimize noise. Keep the input and output traces short and separate to prevent cross-talk.

  • To handle thermal dissipation, ensure good airflow around the device, and consider using a heat sink or thermal pad if the device is expected to operate at high temperatures or high currents.

  • Key considerations for PCB layout include keeping the input and output traces short and separate, using a solid ground plane, and placing the device close to the power source. Also, avoid routing high-frequency signals near the device.