Part Details for FPF2281BUCX_F130 by Fairchild Semiconductor Corporation
Overview of FPF2281BUCX_F130 by Fairchild Semiconductor Corporation
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Part Details for FPF2281BUCX_F130
FPF2281BUCX_F130 CAD Models
FPF2281BUCX_F130 Part Data Attributes:
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FPF2281BUCX_F130
Fairchild Semiconductor Corporation
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FPF2281BUCX_F130
Fairchild Semiconductor Corporation
Buffer/Inverter Based Peripheral Driver, 1 Driver, PBGA12
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FAIRCHILD SEMICONDUCTOR CORP | |
| Part Package Code | CSP | |
| Package Description | VFBGA, BGA12,3X4,16 | |
| Pin Count | 12 | |
| Manufacturer Package Code | 12BALL WLCSP, 3X4 ARRAY, 0.4MM PITCH, 250UM BALL | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Adjustable Threshold | YES | |
| Analog IC - Other Type | POWER SUPPLY SUPPORT CIRCUIT | |
| JESD-30 Code | R-XBGA-B12 | |
| Length | 1.828 mm | |
| Number of Channels | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 12 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA12,3X4,16 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Seated Height-Max | 0.625 mm | |
| Supply Voltage-Max (Vsup) | 25 V | |
| Supply Voltage-Min (Vsup) | 2.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.4 mm | |
| Terminal Position | BOTTOM | |
| Threshold Voltage-Nom | 1.2 | |
| Width | 1.288 mm |