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Overview of EP2SGX30DF780I3N by Altera Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 5 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Education and Research
Consumer Electronics
Internet of Things (IoT)
Industrial Automation
Computing and Data Storage
Financial Technology (Fintech)
Aerospace and Defense
Smart Cities
Telecommunications
Electronic Manufacturing
Communication and Networking
Automotive
CAD Models for EP2SGX30DF780I3N by Altera Corporation
Part Data Attributes for EP2SGX30DF780I3N by Altera Corporation
|
|
|
|---|---|
|
Pbfree Code
|
Yes
|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Transferred
|
|
Ihs Manufacturer
|
ALTERA CORP
|
|
Part Package Code
|
BGA
|
|
Package Description
|
29 X 29 MM, 1 MM PITCH, LEAD FREE, FBGA-780
|
|
Pin Count
|
780
|
|
Reach Compliance Code
|
compliant
|
|
HTS Code
|
8542.39.00.01
|
|
Clock Frequency-Max
|
622.08 MHz
|
|
Combinatorial Delay of a CLB-Max
|
2.99 ns
|
|
JESD-30 Code
|
S-PBGA-B780
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|
JESD-609 Code
|
e1
|
|
Length
|
29 mm
|
|
Number of CLBs
|
33880
|
|
Number of Inputs
|
361
|
|
Number of Logic Cells
|
33380
|
|
Number of Outputs
|
361
|
|
Number of Terminals
|
780
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Organization
|
33880 CLBS
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
BGA
|
|
Package Equivalence Code
|
BGA780,28X28,40
|
|
Package Shape
|
SQUARE
|
|
Package Style
|
GRID ARRAY
|
|
Peak Reflow Temperature (Cel)
|
245
|
|
Programmable Logic Type
|
FIELD PROGRAMMABLE GATE ARRAY
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
3.5 mm
|
|
Supply Voltage-Max
|
1.25 V
|
|
Supply Voltage-Min
|
1.15 V
|
|
Supply Voltage-Nom
|
1.2 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Finish
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
1 mm
|
|
Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
40
|
|
Width
|
29 mm
|
Alternate Parts for EP2SGX30DF780I3N
This table gives cross-reference parts and alternative options found for EP2SGX30DF780I3N. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EP2SGX30DF780I3N, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| EP2SGX30DF780C3 | Field Programmable Gate Array, 33880 CLBs, 717MHz, 33880-Cell, CMOS, PBGA780, 29 X 29 MM, 1 MM PITCH, MS-034AAM-1, FBGA-780 | Intel Corporation | EP2SGX30DF780I3N vs EP2SGX30DF780C3 |
| EP2SGX30DF780I3 | Field Programmable Gate Array, 33880 CLBs, 622.08MHz, 33380-Cell, CMOS, PBGA780, 29 X 29 MM, 1 MM PITCH, FBGA-780 | Intel Corporation | EP2SGX30DF780I3N vs EP2SGX30DF780I3 |
| EP2SGX30DF780C3N | Field Programmable Gate Array, 33880 CLBs, 717MHz, 33880-Cell, CMOS, PBGA780, 29 X 29 MM, 1 MM PITCH, LEAD FREE, MS-034AAM-1, FBGA-780 | Altera Corporation | EP2SGX30DF780I3N vs EP2SGX30DF780C3N |
| EP2SGX30DF780C3N | Field Programmable Gate Array, 33880 CLBs, 717MHz, 33880-Cell, CMOS, PBGA780, 29 X 29 MM, 1 MM PITCH, LEAD FREE, MS-034AAM-1, FBGA-780 | Intel Corporation | EP2SGX30DF780I3N vs EP2SGX30DF780C3N |
| EP2SGX30DF780I3N | Field Programmable Gate Array, 33880 CLBs, 622.08MHz, 33380-Cell, CMOS, PBGA780, 29 X 29 MM, 1 MM PITCH, LEAD FREE, FBGA-780 | Intel Corporation | EP2SGX30DF780I3N vs EP2SGX30DF780I3N |