EP2SGX30DF780I3N
vs
EP2SGX30CF780C4N
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ALTERA CORP
INTEL CORP
Part Package Code
BGA
Package Description
29 X 29 MM, 1 MM PITCH, LEAD FREE, FBGA-780
29 X 29 MM, 1 MM PITCH, LEAD FREE, MS-034AAM-1, FBGA-780
Pin Count
780
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
622.08 MHz
717 MHz
Combinatorial Delay of a CLB-Max
2.99 ns
5.117 ns
JESD-30 Code
S-PBGA-B780
S-PBGA-B780
JESD-609 Code
e1
e1
Length
29 mm
29 mm
Number of CLBs
33880
33880
Number of Inputs
361
361
Number of Logic Cells
33380
33880
Number of Outputs
361
361
Number of Terminals
780
780
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
33880 CLBS
33880 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA780,28X28,40
BGA780,28X28,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
245
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.5 mm
3.5 mm
Supply Voltage-Max
1.25 V
1.25 V
Supply Voltage-Min
1.15 V
1.15 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
29 mm
29 mm
Base Number Matches
1
1
Moisture Sensitivity Level
3
Compare EP2SGX30DF780I3N with alternatives
Compare EP2SGX30CF780C4N with alternatives