EDI8F8257C100BPC
Description: SRAM Module, 256KX8, 100ns, CMOS, SOIC-32

Overview of EDI8F8257C100BPC by White Electronic Designs Corp

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
  • Distributor Offerings: ( 0 listings )
  • Number of FFF Equivalents: ( 0 replacements )
  • CAD Models: ( Request Part )
  • Number of Functional Equivalents: ( 10 options )
  • Part Data Attributes ( Available )
  • Reference Designs: ( Not Available )
Where used in Applications: Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

CAD Models for EDI8F8257C100BPC by White Electronic Designs Corp
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Part Data Attributes for EDI8F8257C100BPC by White Electronic Designs Corp

EDI8F8257C100BPC
White Electronic Designs Corp
-
-
Part Life Cycle Code
Obsolete
Ihs Manufacturer
WHITE ELECTRONIC DESIGNS CORP
Package Description
SOIC-32
Reach Compliance Code
unknown
Access Time-Max
100 ns
I/O Type
COMMON
JESD-30 Code
R-XDMA-X32
Memory Density
2097152 bit
Memory IC Type
SRAM MODULE
Memory Width
8
Number of Functions
1
Number of Terminals
32
Number of Words
262144 words
Number of Words Code
256000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
256KX8
Output Characteristics
3-STATE
Package Body Material
UNSPECIFIED
Package Code
SOJ
Package Equivalence Code
SOJ32,.54
Package Shape
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Standby Current-Max
0.005 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.13 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
UNSPECIFIED
Terminal Pitch
1.27 mm
Terminal Position
DUAL
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  1. EDI8F8257C100BPC
    White Electronic Designs Corp
    SRAM Module, 256KX8, 100ns, CMOS, SOIC-32
    VS

Alternate Parts for EDI8F8257C100BPC

This table gives cross-reference parts and alternative options found for EDI8F8257C100BPC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EDI8F8257C100BPC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
MS8256FKXL-85 SRAM Module, 256KX8, 85ns, CMOS APTA Group Inc EDI8F8257C100BPC vs MS8256FKXL-85
DPS256S8EL4-30C SRAM Module, 256KX8, 30ns, CMOS B&B Electronics Manufacturing Company EDI8F8257C100BPC vs DPS256S8EL4-30C
EDI8M8257P45P6B SRAM Module, 256KX8, 45ns, CMOS, Electronic Designs Inc EDI8F8257C100BPC vs EDI8M8257P45P6B
5962-9315702HXA Multi-Port SRAM Module, 256KX8, 100ns, CMOS, CDIP32, White Electronic Designs Corp EDI8F8257C100BPC vs 5962-9315702HXA
WS256K8-100CMA SRAM Module, 256KX8, 100ns, CMOS, CDIP32, White Microelectronics EDI8F8257C100BPC vs WS256K8-100CMA
EDI8M8257C85P6B SRAM Module, 256KX8, 85ns, CMOS, Electronic Designs Inc EDI8F8257C100BPC vs EDI8M8257C85P6B
DPS256S8EJ4-35CI SRAM Module, 256KX8, 35ns, CMOS B&B Electronics Manufacturing Company EDI8F8257C100BPC vs DPS256S8EJ4-35CI
MSM8256VMB-55 SRAM Module, 256KX8, 55ns, CMOS, CDXA32 Mosaic Semiconductor Inc EDI8F8257C100BPC vs MSM8256VMB-55
DPS256S8N-12C SRAM Module, 256KX8, 120ns, CMOS, CDMA32 Twilight Technology Inc EDI8F8257C100BPC vs DPS256S8N-12C
EMS256K8CMO2-100I SRAM Module, 256KX8, 100ns, CMOS, CDMA32 Elpaq EDI8F8257C100BPC vs EMS256K8CMO2-100I

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