Part Details for EDI8F82045C70B6C by White Electronic Designs Corp
Overview of EDI8F82045C70B6C by White Electronic Designs Corp
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (9 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Internet of Things (IoT)
Industrial Automation
Computing and Data Storage
Aerospace and Defense
Healthcare
Electronic Manufacturing
Telecommunications
Automotive
Part Details for EDI8F82045C70B6C
EDI8F82045C70B6C CAD Models
EDI8F82045C70B6C Part Data Attributes
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EDI8F82045C70B6C
White Electronic Designs Corp
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Datasheet
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EDI8F82045C70B6C
White Electronic Designs Corp
SRAM Module, 2MX8, 70ns, CMOS, DIP-36
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | WHITE ELECTRONIC DESIGNS CORP | |
Package Description | DIP-36 | |
Reach Compliance Code | unknown | |
Access Time-Max | 70 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-XDMA-T36 | |
Memory Density | 16777216 bit | |
Memory IC Type | SRAM MODULE | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 36 | |
Number of Words | 2097152 words | |
Number of Words Code | 2000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 2MX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | UNSPECIFIED | |
Package Code | DIP | |
Package Equivalence Code | DIP36,.6 | |
Package Shape | RECTANGULAR | |
Package Style | MICROELECTRONIC ASSEMBLY | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Standby Current-Max | 0.003 A | |
Standby Voltage-Min | 4.5 V | |
Supply Current-Max | 0.15 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Alternate Parts for EDI8F82045C70B6C
This table gives cross-reference parts and alternative options found for EDI8F82045C70B6C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EDI8F82045C70B6C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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EDI8F82045C70B6I | SRAM Module, 2MX8, 70ns, CMOS, DIP-36 | White Electronic Designs Corp | EDI8F82045C70B6C vs EDI8F82045C70B6I |
EDI8F82045LP70B6C | SRAM Module, 2MX8, 70ns, CMOS, DIP-36 | White Electronic Designs Corp | EDI8F82045C70B6C vs EDI8F82045LP70B6C |
SYS82000FKX-70 | SRAM Module, 2MX8, 70ns, CMOS, 0.600 INCH, LOW PROFILE, PLASTIC, DIP-36 | Mosaic Semiconductor Inc | EDI8F82045C70B6C vs SYS82000FKX-70 |
SYS82000FKXA-70 | SRAM Module, 2MX8, 70ns, CMOS, PDIP36, PLASTIC, DIP-36 | Mosaic Semiconductor Inc | EDI8F82045C70B6C vs SYS82000FKXA-70 |
SYS82000FKXAI-70 | SRAM Module, 2MX8, 70ns, CMOS, PDIP36, PLASTIC, DIP-36 | Mosaic Semiconductor Inc | EDI8F82045C70B6C vs SYS82000FKXAI-70 |
SYS82000FKXI-70 | SRAM Module, 2MX8, 70ns, CMOS, 0.600 INCH, LOW PROFILE, PLASTIC, DIP-36 | Mosaic Semiconductor Inc | EDI8F82045C70B6C vs SYS82000FKXI-70 |
SYS82000FKXLI-70 | SRAM Module, 2MX8, 70ns, CMOS, PDMA36, 0.600 INCH, LOW PROFILE, PLASTIC, MODULE, DIP-36 | APTA Group Inc | EDI8F82045C70B6C vs SYS82000FKXLI-70 |
IDT7M4084L70N | SRAM Module, 2MX8, 70ns, CMOS | Integrated Device Technology Inc | EDI8F82045C70B6C vs IDT7M4084L70N |
SYS82000FKXLI-70 | SRAM Module, 2MX8, 70ns, CMOS, 0.600 INCH, LOW PROFILE, PLASTIC, DIP-36 | Mosaic Semiconductor Inc | EDI8F82045C70B6C vs SYS82000FKXLI-70 |