There are no models available for this part yet.
Overview of EDI88130CS55TB by Microsemi Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 6 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for EDI88130CS55TB by Microsemi Corporation
Part Data Attributes for EDI88130CS55TB by Microsemi Corporation
|
|
|
|---|---|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Transferred
|
|
Ihs Manufacturer
|
MICROSEMI CORP
|
|
Part Package Code
|
DIP
|
|
Package Description
|
0.400 INCH, SIDE BRAZED, CERAMIC, DIP-32
|
|
Pin Count
|
32
|
|
Reach Compliance Code
|
unknown
|
|
ECCN Code
|
3A001.A.2.C
|
|
HTS Code
|
8542.32.00.41
|
|
Access Time-Max
|
55 ns
|
|
JESD-30 Code
|
R-CDIP-T32
|
|
Length
|
40.64 mm
|
|
Memory Density
|
1048576 bit
|
|
Memory IC Type
|
STANDARD SRAM
|
|
Memory Width
|
8
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
32
|
|
Number of Words
|
131072 words
|
|
Number of Words Code
|
128000
|
|
Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
125 °C
|
|
Operating Temperature-Min
|
-55 °C
|
|
Organization
|
128KX8
|
|
Package Body Material
|
CERAMIC, METAL-SEALED COFIRED
|
|
Package Code
|
DIP
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
IN-LINE
|
|
Parallel/Serial
|
PARALLEL
|
|
Qualification Status
|
Not Qualified
|
|
Screening Level
|
MIL-STD-883
|
|
Seated Height-Max
|
3.937 mm
|
|
Supply Voltage-Max (Vsup)
|
5.5 V
|
|
Supply Voltage-Min (Vsup)
|
4.5 V
|
|
Supply Voltage-Nom (Vsup)
|
5 V
|
|
Surface Mount
|
NO
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
MILITARY
|
|
Terminal Form
|
THROUGH-HOLE
|
|
Terminal Pitch
|
2.54 mm
|
|
Terminal Position
|
DUAL
|
|
Width
|
10.16 mm
|
Alternate Parts for EDI88130CS55TB
This table gives cross-reference parts and alternative options found for EDI88130CS55TB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EDI88130CS55TB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 5962-8959834MZA | Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, | QP Semiconductor | EDI88130CS55TB vs 5962-8959834MZA |
| 5962-8959834MZA | Standard SRAM, 128KX8, 55ns, CMOS, DIP-32 | Microsemi Corporation | EDI88130CS55TB vs 5962-8959834MZA |
| EDI88130CS55TI | Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, 0.400 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | EDI88130CS55TB vs EDI88130CS55TI |
| EDI88130CS55TM | Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, 0.400 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | EDI88130CS55TB vs EDI88130CS55TM |
| 5962-8959834MZX | Standard SRAM, 128KX8, 45ns, CMOS, CDIP32, 0.400 INCH, CERAMIC, DIP-32 | Minco Technology Labs LLC | EDI88130CS55TB vs 5962-8959834MZX |
| EDI88130CS55TC | Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, 0.400 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | EDI88130CS55TB vs EDI88130CS55TC |