Datasheets
DPZ128X32IV3-17M by:

Flash Module, 128KX32, 170ns, CERAMIC, MODULE, SLCC, PGA-66

Part Details for DPZ128X32IV3-17M by B&B Electronics Manufacturing Company

Overview of DPZ128X32IV3-17M by B&B Electronics Manufacturing Company

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Applications Internet of Things (IoT) Environmental Monitoring Industrial Automation Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Renewable Energy Entertainment and Gaming Robotics and Drones

Part Details for DPZ128X32IV3-17M

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DPZ128X32IV3-17M Part Data Attributes

DPZ128X32IV3-17M B&B Electronics Manufacturing Company
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DPZ128X32IV3-17M B&B Electronics Manufacturing Company Flash Module, 128KX32, 170ns, CERAMIC, MODULE, SLCC, PGA-66
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer DPAC TECHNOLOGIES CORP
Part Package Code PGA
Package Description APGA, PGA66,11X11
Pin Count 66
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.51
Access Time-Max 170 ns
Alternate Memory Width 16
Data Polling NO
JESD-30 Code S-XPGA-P66
JESD-609 Code e0
Memory Density 4194304 bit
Memory IC Type FLASH MODULE
Memory Width 32
Number of Functions 1
Number of Terminals 66
Number of Words 131072 words
Number of Words Code 128000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 128KX32
Output Characteristics 3-STATE
Package Body Material UNSPECIFIED
Package Code APGA
Package Equivalence Code PGA66,11X11
Package Shape SQUARE
Package Style GRID ARRAY, PIGGYBACK
Parallel/Serial PARALLEL
Programming Voltage 12 V
Qualification Status Not Qualified
Seated Height-Max 4.1402 mm
Standby Current-Max 0.0004 A
Supply Current-Max 0.12 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology MOS
Temperature Grade MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form PIN/PEG
Terminal Pitch 2.54 mm
Terminal Position PERPENDICULAR
Toggle Bit NO
Type NOR TYPE

Alternate Parts for DPZ128X32IV3-17M

This table gives cross-reference parts and alternative options found for DPZ128X32IV3-17M. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DPZ128X32IV3-17M, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
DPZ128X32IV3-17M Flash Module, 128KX32, 170ns, CERAMIC, MODULE, SLCC, PGA-66 Twilight Technology Inc DPZ128X32IV3-17M vs DPZ128X32IV3-17M
DPZ128X32IV3-17B Flash Module, 128KX32, 170ns, CERAMIC, MODULE, SLCC, PGA-66 Twilight Technology Inc DPZ128X32IV3-17M vs DPZ128X32IV3-17B
DPZ128X32IV3-17I Flash Module, 128KX32, 170ns, CERAMIC, MODULE, SLCC, PGA-66 Twilight Technology Inc DPZ128X32IV3-17M vs DPZ128X32IV3-17I
Part Number Description Manufacturer Compare
5962-9458504HXC EEPROM Module, 512KX8, 150ns, Parallel, CMOS, CHIP66, Microsemi Corporation DPZ128X32IV3-17M vs 5962-9458504HXC
WE128K32N-250H1I EEPROM Module, 128KX32, 250ns, Parallel, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation DPZ128X32IV3-17M vs WE128K32N-250H1I
WE128K32N-120H1M EEPROM Module, 128KX32, 120ns, Parallel, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation DPZ128X32IV3-17M vs WE128K32N-120H1M
DPZ128X32VA-12C Flash Module, 512KX8, 120ns, CPGA66, CERAMIC, PGA-66 B&B Electronics Manufacturing Company DPZ128X32IV3-17M vs DPZ128X32VA-12C
5962-9471601H8X Flash Module, 128KX32, 150ns, CPGA66, CERAMIC, PGA-66 Microsemi Corporation DPZ128X32IV3-17M vs 5962-9471601H8X
WE128K32N250H1M 128KX32 EEPROM 5V MODULE, 250ns, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation DPZ128X32IV3-17M vs WE128K32N250H1M
WE128K32N-200H1MA EEPROM Module, 128KX32, 200ns, Parallel, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation DPZ128X32IV3-17M vs WE128K32N-200H1MA
WF128K32-150HM5 Flash Module, 512KX8, 150ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation DPZ128X32IV3-17M vs WF128K32-150HM5
DPE128X32V-15M EEPROM Module, 512KX8, 150ns, Parallel, CMOS, CPGA66, PGA-66 B&B Electronics Manufacturing Company DPZ128X32IV3-17M vs DPE128X32V-15M
5962-9458501HTC EEPROM Module, 512KX8, 300ns, Parallel, CMOS, CHIP66, Microsemi Corporation DPZ128X32IV3-17M vs 5962-9458501HTC

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