Datasheets
DPV27C101-200B by:

UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERDIP-32

Part Details for DPV27C101-200B by B&B Electronics Manufacturing Company

Overview of DPV27C101-200B by B&B Electronics Manufacturing Company

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Applications Industrial Automation

Available Datasheets

Part # Manufacturer Description Datasheet
D6417709SHX200BV Renesas Electronics Corporation 32-bit Microcontrollers
R5S76710B200BG Renesas Electronics Corporation 32-bit Microcontrollers (Non Promotion)
R5S76700B200BG Renesas Electronics Corporation 32-bit Microcontrollers (Non Promotion)

Part Details for DPV27C101-200B

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DPV27C101-200B Part Data Attributes

DPV27C101-200B B&B Electronics Manufacturing Company
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DPV27C101-200B B&B Electronics Manufacturing Company UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERDIP-32
Part Life Cycle Code Transferred
Ihs Manufacturer DPAC TECHNOLOGIES CORP
Part Package Code DIP
Package Description CERDIP-32
Pin Count 32
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.61
Access Time-Max 200 ns
JESD-30 Code R-GDIP-T32
Length 41.91 mm
Memory Density 1048576 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 131072 words
Number of Words Code 128000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 128KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code WDIP
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.842 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for DPV27C101-200B

This table gives cross-reference parts and alternative options found for DPV27C101-200B. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DPV27C101-200B, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
5962-8961403XX UVPROM, 128KX8, 200ns, CMOS, CDIP32 AMD DPV27C101-200B vs 5962-8961403XX
DPV27C101-200I UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERDIP-32 B&B Electronics Manufacturing Company DPV27C101-200B vs DPV27C101-200I
NM27C010Q200 128KX8 UVPROM, 200ns, CDIP32, WINDOWED, CERAMIC, DIP-32 Texas Instruments DPV27C101-200B vs NM27C010Q200
AM27C010-200DI UVPROM, 128KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 AMD DPV27C101-200B vs AM27C010-200DI
TC571000D-200 IC 128K X 8 UVPROM, 200 ns, CDIP32, CERDIP-32, Programmable ROM Toshiba America Electronic Components DPV27C101-200B vs TC571000D-200
NMC27C010QE200 UVPROM, 128KX8, 200ns, CMOS, CDIP32 National Semiconductor Corporation DPV27C101-200B vs NMC27C010QE200
5962-8961403XX UVPROM, 128KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 Intel Corporation DPV27C101-200B vs 5962-8961403XX
TMS27C010A-200JL 128KX8 UVPROM, 200ns, CDIP32, 0.600 INCH, WINDOWED, CERAMIC, DIP-32 Texas Instruments DPV27C101-200B vs TMS27C010A-200JL
NMC27C010Q200 128KX8 UVPROM, 200ns, CDIP32, CERAMIC, DIP-32 Texas Instruments DPV27C101-200B vs NMC27C010Q200
MBM27C1000-20Z Memory IC FUJITSU Limited DPV27C101-200B vs MBM27C1000-20Z
Part Number Description Manufacturer Compare
5962-9309104HYA EEPROM Module, 512KX8, 200ns, Parallel, CMOS, CDIP32, DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32 Microsemi Corporation DPV27C101-200B vs 5962-9309104HYA
SST39SF010A-70-4C-PHE Flash, 128KX8, 70ns, PDIP32, ROHS COMPLIANT, PLASTIC, MO-015AP, DIP-32 Silicon Storage Technology DPV27C101-200B vs SST39SF010A-70-4C-PHE
AT28LV010-25PJ EEPROM, 128KX8, 250ns, Parallel, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Atmel Corporation DPV27C101-200B vs AT28LV010-25PJ
SMJ27C010A-20JM 128KX8 UVPROM, 200ns, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Texas Instruments DPV27C101-200B vs SMJ27C010A-20JM
WME128K8-140CIA EEPROM, 128KX8, 140ns, Parallel, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation DPV27C101-200B vs WME128K8-140CIA
5962-8961403MXX UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERAMIC, DIP-32 QP Semiconductor DPV27C101-200B vs 5962-8961403MXX
CAT28F010LA-90 128KX8 FLASH 12V PROM, 90ns, PDIP32, LEAD AND HALOGEN FREE, PLASTIC, DIP-32 onsemi DPV27C101-200B vs CAT28F010LA-90
NM27C010QE150 128KX8 UVPROM, 150ns, CDIP32, WINDOWED, CERAMIC, DIP-32 Texas Instruments DPV27C101-200B vs NM27C010QE150
CAT28F010PA-70 Flash, 128KX8, 70ns, PDIP32, PLASTIC, DIP-32 Catalyst Semiconductor DPV27C101-200B vs CAT28F010PA-70
WME128K8-300CIA EEPROM, 128KX8, 300ns, Parallel, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation DPV27C101-200B vs WME128K8-300CIA

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