Part Details for DP5Z4MX16PA3-12B by B&B Electronics Manufacturing Company
Overview of DP5Z4MX16PA3-12B by B&B Electronics Manufacturing Company
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- Number of FFF Equivalents:
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- Number of Functional Equivalents:
- Part Data Attributes
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Part Details for DP5Z4MX16PA3-12B
DP5Z4MX16PA3-12B CAD Models
DP5Z4MX16PA3-12B Part Data Attributes
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DP5Z4MX16PA3-12B
B&B Electronics Manufacturing Company
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Datasheet
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DP5Z4MX16PA3-12B
B&B Electronics Manufacturing Company
Flash Module, 4MX16, 120ns, CPGA50, HERMETIC SEALED, CERAMIC, MODULE, SLCC, PGA-50
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Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | DPAC TECHNOLOGIES CORP | |
Part Package Code | PGA | |
Package Description | APGA, PGA50,5X10 | |
Pin Count | 50 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.32.00.51 | |
Access Time-Max | 120 ns | |
Data Polling | NO | |
JESD-30 Code | R-CPGA-P50 | |
JESD-609 Code | e0 | |
Length | 25.146 mm | |
Memory Density | 67108864 bit | |
Memory IC Type | FLASH MODULE | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Sectors/Size | 64 | |
Number of Terminals | 50 | |
Number of Words | 4194304 words | |
Number of Words Code | 4000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 4MX16 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | APGA | |
Package Equivalence Code | PGA50,5X10 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, PIGGYBACK | |
Page Size | 64 words | |
Parallel/Serial | PARALLEL | |
Programming Voltage | 5 V | |
Qualification Status | Not Qualified | |
Screening Level | 38535Q/M;38534H;883B | |
Seated Height-Max | 11.9888 mm | |
Sector Size | 64K | |
Standby Current-Max | 0.0008 A | |
Supply Current-Max | 0.17 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | PIN/PEG | |
Terminal Pitch | 2.54 mm | |
Terminal Position | PERPENDICULAR | |
Toggle Bit | NO | |
Type | NOR TYPE | |
Width | 13.716 mm |
Alternate Parts for DP5Z4MX16PA3-12B
This table gives cross-reference parts and alternative options found for DP5Z4MX16PA3-12B. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DP5Z4MX16PA3-12B, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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DP5Z4MX16PA3-12C | Flash Module, 4MX16, 120ns, CPGA50, HERMETIC SEALED, CERAMIC, MODULE, SLCC, PGA-50 | B&B Electronics Manufacturing Company | DP5Z4MX16PA3-12B vs DP5Z4MX16PA3-12C |
DP5Z4MX16PA3-12C | Flash Module, 4MX16, 120ns, CPGA50, HERMETIC SEALED, CERAMIC, MODULE, SLCC, PGA-50 | Twilight Technology Inc | DP5Z4MX16PA3-12B vs DP5Z4MX16PA3-12C |
DP5Z4MX16PA3-12B | Flash Module, 4MX16, 120ns, CPGA50, HERMETIC SEALED, CERAMIC, MODULE, SLCC, PGA-50 | Twilight Technology Inc | DP5Z4MX16PA3-12B vs DP5Z4MX16PA3-12B |
DP5Z4MX16PA3-12M | Flash Module, 4MX16, 120ns, CPGA50, HERMETIC SEALED, CERAMIC, MODULE, SLCC, PGA-50 | Twilight Technology Inc | DP5Z4MX16PA3-12B vs DP5Z4MX16PA3-12M |
DP5Z4MX16PA3-12M | Flash Module, 4MX16, 120ns, CPGA50, HERMETIC SEALED, CERAMIC, MODULE, SLCC, PGA-50 | B&B Electronics Manufacturing Company | DP5Z4MX16PA3-12B vs DP5Z4MX16PA3-12M |
DP5Z4MX16PA3-12I | Flash Module, 4MX16, 120ns, CPGA50, HERMETIC SEALED, CERAMIC, MODULE, SLCC, PGA-50 | B&B Electronics Manufacturing Company | DP5Z4MX16PA3-12B vs DP5Z4MX16PA3-12I |