Datasheets
DL6009BG352EC by:

Field Programmable Gate Array, 256-Cell, CMOS, PBGA352,

Part Details for DL6009BG352EC by AMD Xilinx

Overview of DL6009BG352EC by AMD Xilinx

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Part Details for DL6009BG352EC

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DL6009BG352EC Part Data Attributes:

DL6009BG352EC AMD Xilinx
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DL6009BG352EC AMD Xilinx Field Programmable Gate Array, 256-Cell, CMOS, PBGA352,
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
JESD-30 Code S-PBGA-B352
JESD-609 Code e0
Length 35 mm
Moisture Sensitivity Level 3
Number of CLBs 256
Number of Inputs 128
Number of Logic Cells 256
Number of Outputs 128
Number of Terminals 352
Operating Temperature-Max 85 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA352,26X26,50
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Supply Voltage-Max 3.47 V
Supply Voltage-Min 3.14 V
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 35 mm

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