Part Details for CY7C1315KV18-333BZXC by Infineon Technologies AG
Overview of CY7C1315KV18-333BZXC by Infineon Technologies AG
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (3 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for CY7C1315KV18-333BZXC
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
CY7C1315KV18-333BZ
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Avnet Americas | SRAM Chip Sync Single 1.8V 18M-Bit 512K x 36 165-Pin FBGA Tray - Trays (Alt: CY7C1315KV18-333BZ) RoHS: Compliant Min Qty: 272 Package Multiple: 136 Container: Tray | 0 |
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RFQ | |
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DISTI #
CY7C1315KV18-333BZ
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Avnet Americas | SRAM Chip Sync Single 1.8V 18M-Bit 512K x 36 165-Pin FBGA Tray - Trays (Alt: CY7C1315KV18-333BZ) RoHS: Compliant Min Qty: 25 Package Multiple: 1 Lead time: 0 Weeks, 2 Days Container: Tray | 0 |
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$26.9148 / $30.5850 | Buy Now |
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Rochester Electronics | CY7C1315KV18 - Sync SRAMs RoHS: Compliant Status: End of Life / Last Time Buy Min Qty: 1 | Call for Availability |
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RFQ |
Part Details for CY7C1315KV18-333BZXC
CY7C1315KV18-333BZXC CAD Models
CY7C1315KV18-333BZXC Part Data Attributes
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CY7C1315KV18-333BZXC
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
CY7C1315KV18-333BZXC
Infineon Technologies AG
QDR SRAM, 512KX36, CMOS, PBGA165, FBGA-165
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | FBGA-165 | |
| Reach Compliance Code | compliant | |
| Samacsys Manufacturer | Infineon | |
| Additional Feature | BURST ARCHITECTURE | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e1 | |
| Length | 15 mm | |
| Memory Density | 18874368 bit | |
| Memory IC Type | QDR SRAM | |
| Memory Width | 36 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 512KX36 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.4 mm | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 13 mm |
Alternate Parts for CY7C1315KV18-333BZXC
This table gives cross-reference parts and alternative options found for CY7C1315KV18-333BZXC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1315KV18-333BZXC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| CY7C1315KV18-333BZC | QDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | CY7C1315KV18-333BZXC vs CY7C1315KV18-333BZC |
| CY7C1315KV18-333BZXC | QDR SRAM, 512KX36, CMOS, PBGA165, FBGA-165 | Cypress Semiconductor | CY7C1315KV18-333BZXC vs CY7C1315KV18-333BZXC |
| CY7C1315KV18-333BZC | QDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Infineon Technologies AG | CY7C1315KV18-333BZXC vs CY7C1315KV18-333BZC |