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Drivers And Interfaces / Peripheral Drivers / BD1HC500EFJ-CE2
Datasheets
BD1HC500EFJ-CE2 by: ROHM Semiconductor

Buffer/Inverter Based Peripheral Driver,

Part Details for BD1HC500EFJ-CE2 by ROHM Semiconductor

Results Overview of BD1HC500EFJ-CE2 by ROHM Semiconductor

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Applications Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

BD1HC500EFJ-CE2 Information

BD1HC500EFJ-CE2 by ROHM Semiconductor is a Peripheral Driver.
Peripheral Drivers are under the broader part category of Drivers And Interfaces.

A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.

Price & Stock for BD1HC500EFJ-CE2

Part # Distributor Description Stock Price Buy
DISTI # 02AC9585
Newark Power Load Switch, Aec-Q100, 18V, Htsop8, Power Load Switch Type:High Side, Input Voltage:18V, Cu... rrent Limit:1.45A, On State Resistance:0.5Ohm, Distribution Switch Case Style:Htsop, No. Of Pins:8Pins, Thermal Protection:Yes, On/Rohs Compliant: Yes |Rohm BD1HC500EFJ-CE2 more RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Cut Tape 0
  • 1 $2.1300
  • 10 $1.3600
  • 25 $1.2500
  • 50 $1.1200
  • 100 $1.0000
  • 250 $0.9170
  • 500 $0.8300
  • 1,000 $0.6970
$0.6970 / $2.1300 Buy Now
DISTI # BD1HC500EFJ-CE2CT-ND
DigiKey IC PWR SWITCH P-CHAN 1:1 8HTSOP Min Qty: 1 Lead time: 15 Weeks Container: Cut Tape (CT), Digi-Reel®, Tape & Reel (TR) 3111
In Stock
  • 1 $2.0900
  • 10 $1.3010
  • 25 $1.0956
  • 100 $0.8629
  • 250 $0.7487
  • 500 $0.6784
  • 1,000 $0.6195
  • 2,500 $0.5561
  • 5,000 $0.5200
$0.5200 / $2.0900 Buy Now
DISTI # 755-BD1HC500EFJ-CE2
Mouser Electronics Power Switch ICs - Power Distribution 1ch High-side swtch 4-18V, TSD off-latch RoHS: Compliant 2752
  • 1 $2.0800
  • 10 $1.3100
  • 25 $1.1000
  • 100 $0.8630
  • 250 $0.7490
  • 500 $0.6790
  • 1,000 $0.5570
  • 2,500 $0.5200
$0.5200 / $2.0800 Buy Now
Future Electronics AECQ IPDs RoHS: Not Compliant pbFree: Yes Min Qty: 2500 Package Multiple: 2500 Lead time: 17 Weeks Container: Reel 0
Reel
  • 2,500 $0.5300
  • 5,000 $0.5200
$0.5200 / $0.5300 Buy Now
DISTI # 86987830
Verical Current Limit SW 1-IN 2-OUT -0.3V to 12V 0.8A Automotive 8-Pin HTSOP-J EP T/R Min Qty: 28 Package Multiple: 1 Date Code: 1501 Americas - 28
  • 28 $2.6918
$2.6918 Buy Now
CoreStaff Co Ltd RoHS(Ship within 1day) - D/C 2015 Date Code: 2015 28
  • 1 $0.5540
  • 10 $0.5390
  • 50 $0.5290
  • 100 $0.5190
  • 500 $0.5170
  • 1,000 $0.5160
$0.5160 / $0.5540 Buy Now

Part Details for BD1HC500EFJ-CE2

BD1HC500EFJ-CE2 CAD Models

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BD1HC500EFJ-CE2 Part Data Attributes

Parametric Data
BD1HC500EFJ-CE2 ROHM Semiconductor
Buy Now Datasheet
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BD1HC500EFJ-CE2 ROHM Semiconductor Buffer/Inverter Based Peripheral Driver,
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Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ROHM CO LTD
Package Description HTSOP-8
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Samacsys Manufacturer ROHM Semiconductor
Built-in Protections TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE
Driver Number of Bits 1
Input Characteristics SCHMITT TRIGGER
Interface IC Type BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 Code R-PDSO-G8
Length 4.9 mm
Number of Functions 1
Number of Terminals 8
Operating Temperature-Max 150 °C
Operating Temperature-Min -40 °C
Output Current Flow Direction SINK
Output Current-Max 0.8 A
Package Body Material PLASTIC/EPOXY
Package Code HVSOP
Package Equivalence Code TSOP8,.24,50
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Screening Level AEC-Q100
Seated Height-Max 1 mm
Supply Current-Max 3 mA
Supply Voltage-Max 18 V
Supply Voltage-Min 4 V
Supply Voltage-Nom 12 V
Surface Mount YES
Terminal Form GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Turn-off Time 25 µs
Turn-on Time 25 µs
Width 3.9 mm

BD1HC500EFJ-CE2 Related Parts

BD1HC500EFJ-CE2 Frequently Asked Questions (FAQ)

  • ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.

  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves, ensure good thermal design, and consider using a heat sink or thermal interface material.

  • Although the datasheet doesn't specify a maximum allowed voltage for the input pins, it's generally recommended to limit the input voltage to 5.5V to prevent damage to the internal ESD protection diodes.

  • While the BD1HC500EFJ-CE2 is suitable for high-frequency switching applications, it's essential to consider the device's switching characteristics, such as rise and fall times, and ensure that the layout and design can handle the high-frequency operation.

  • ROHM recommends following a controlled power-up and power-down sequencing to prevent damage to the device. A soft-start circuit or a power sequencer can be used to ensure a safe and reliable startup and shutdown.