Part Details for AT572D740 by Atmel Corporation
Overview of AT572D740 by Atmel Corporation
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Applications
Education and Research
Industrial Automation
Aerospace and Defense
Agriculture Technology
Renewable Energy
Robotics and Drones
Part Details for AT572D740
AT572D740 CAD Models
AT572D740 Part Data Attributes:
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AT572D740
Atmel Corporation
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AT572D740
Atmel Corporation
Mixed Signal Processor, 32-Bit Size, 16-Ext Bit, 100MHz, CMOS, PBGA352, PLASTIC, BGA-352
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | ATMEL CORP | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA352,26X26,50 | |
| Pin Count | 352 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 19 | |
| Barrel Shifter | NO | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 100 MHz | |
| External Data Bus Width | 16 | |
| Format | FLOATING POINT | |
| Internal Bus Architecture | MULTIPLE | |
| JESD-30 Code | S-PBGA-B352 | |
| JESD-609 Code | e0 | |
| Length | 35 mm | |
| Number of Terminals | 352 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| RAM (words) | 17408 | |
| Seated Height-Max | 2.56 mm | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, MIXED |