Part Details for AS6C3216-55BIN by Alliance Memory Inc
Overview of AS6C3216-55BIN by Alliance Memory Inc
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- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
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Price & Stock for AS6C3216-55BIN
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
AS6C3216-55BIN
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Avnet Americas | SRAM Chip Async Single 3V 32M-Bit 2M x 16 55ns 48-Pin TFBGA Tray - Trays (Alt: AS6C3216-55BIN) RoHS: Not Compliant Min Qty: 480 Package Multiple: 480 Container: Tray | 0 |
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RFQ | |
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DISTI #
AS6C3216-55BIN
|
Avnet Americas | SRAM Chip Async Single 3V 32M-Bit 2M x 16 55ns 48-Pin TFBGA Tray - Trays (Alt: AS6C3216-55BIN) RoHS: Not Compliant Min Qty: 480 Package Multiple: 480 Container: Tray | 0 |
|
RFQ | |
|
DISTI #
AS6C3216-55BIN
|
Avnet Americas | SRAM Chip Async Single 3V 32M-Bit 2M x 16 55ns 48-Pin TFBGA Tray - Trays (Alt: AS6C3216-55BIN) RoHS: Not Compliant Min Qty: 480 Package Multiple: 480 Container: Tray | 0 |
|
RFQ |
Part Details for AS6C3216-55BIN
AS6C3216-55BIN CAD Models
AS6C3216-55BIN Part Data Attributes
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AS6C3216-55BIN
Alliance Memory Inc
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Datasheet
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AS6C3216-55BIN
Alliance Memory Inc
Standard SRAM, 2MX16, 55ns, CMOS, PBGA48, 8 X 10 MM, ROHS COMPLIANT, MO-207, TFBGA-48
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ALLIANCE MEMORY INC | |
| Package Description | LFBGA, BGA48,6X8,30 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | ||
| Samacsys Manufacturer | Alliance Memory | |
| Access Time-Max | 55 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B48 | |
| Length | 10 mm | |
| Memory Density | 33554432 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 48 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 2MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA48,6X8,30 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 mm | |
| Standby Current-Max | 0.002 A | |
| Standby Voltage-Min | 1.2 V | |
| Supply Current-Max | 0.08 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.75 mm | |
| Terminal Position | BOTTOM | |
| Width | 8 mm |