There are no models available for this part yet.
Overview of AS27C256-30ECAI by Micross Components
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
CAD Models for AS27C256-30ECAI by Micross Components
Part Data Attributes for AS27C256-30ECAI by Micross Components
|
|
|
|---|---|
|
Part Life Cycle Code
|
Active
|
|
Ihs Manufacturer
|
MICROSS COMPONENTS
|
|
Part Package Code
|
QFJ
|
|
Package Description
|
0.450 X 0.550 INCH, CERAMIC, LCC-32
|
|
Pin Count
|
32
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.61
|
|
Access Time-Max
|
300 ns
|
|
I/O Type
|
COMMON
|
|
JESD-30 Code
|
R-CQCC-N32
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|
JESD-609 Code
|
e4
|
|
Length
|
13.97 mm
|
|
Memory Density
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262144 bit
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Memory IC Type
|
UVPROM
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Memory Width
|
8
|
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Number of Functions
|
1
|
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Number of Terminals
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32
|
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Number of Words
|
32768 words
|
|
Number of Words Code
|
32000
|
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Operating Mode
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ASYNCHRONOUS
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|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Organization
|
32KX8
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Output Characteristics
|
3-STATE
|
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Package Body Material
|
CERAMIC, METAL-SEALED COFIRED
|
|
Package Code
|
QCCN
|
|
Package Equivalence Code
|
LCC32,.45X.55
|
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Package Shape
|
RECTANGULAR
|
|
Package Style
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CHIP CARRIER
|
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Parallel/Serial
|
PARALLEL
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|
Programming Voltage
|
12.5 V
|
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Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
3.048 mm
|
|
Standby Current-Max
|
0.0003 A
|
|
Supply Current-Max
|
0.025 mA
|
|
Supply Voltage-Max (Vsup)
|
5.5 V
|
|
Supply Voltage-Min (Vsup)
|
4.5 V
|
|
Supply Voltage-Nom (Vsup)
|
5 V
|
|
Surface Mount
|
YES
|
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Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Finish
|
PALLADIUM GOLD
|
|
Terminal Form
|
NO LEAD
|
|
Terminal Pitch
|
1.27 mm
|
|
Terminal Position
|
QUAD
|
|
Width
|
11.43 mm
|
Alternate Parts for AS27C256-30ECAI
This table gives cross-reference parts and alternative options found for AS27C256-30ECAI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AS27C256-30ECAI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| QP27C256L-300/ZA | UVPROM, 32KX8, 300ns, CMOS, CQCC32, CERAMIC, LCC-32 | Teledyne e2v | AS27C256-30ECAI vs QP27C256L-300/ZA |
| 5962-8606313YA | UVPROM, 32KX8, 300ns, CMOS, CQCC32, CERAMIC, LCC-32 | QP Semiconductor | AS27C256-30ECAI vs 5962-8606313YA |
| AM27C256-300LI | UVPROM, 32KX8, 300ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | AS27C256-30ECAI vs AM27C256-300LI |
| AS27C256-30ECAXT | UVPROM, 32KX8, 300ns, CMOS, CQCC32, 0.450 X 0.550 INCH, CERAMIC, LCC-32 | Micross Components | AS27C256-30ECAI vs AS27C256-30ECAXT |
| 27LV256-30/K | 32K X 8 UVPROM, 300 ns, CQCC32, CERAMIC, LCC-32 | Microchip Technology Inc | AS27C256-30ECAI vs 27LV256-30/K |
| AM27256-3LE | UVPROM, 32KX8, 300ns, NMOS, CQCC32, CERAMIC, LCC-32 | AMD | AS27C256-30ECAI vs AM27256-3LE |
| AM27C256-305LCB | UVPROM, 32KX8, 300ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | AS27C256-30ECAI vs AM27C256-305LCB |
| AM27C256-300/BUA | UVPROM, 32KX8, 300ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | AS27C256-30ECAI vs AM27C256-300/BUA |
| QP27C256L-170/UA | UVPROM, 32KX8, 300ns, CMOS, JLCC-32 | Teledyne e2v | AS27C256-30ECAI vs QP27C256L-170/UA |
| 5662-860633YC | UVPROM, 32KX8, 300ns, CMOS, CQCC32, CERAMIC, LCC-32 | Teledyne e2v | AS27C256-30ECAI vs 5662-860633YC |