AS27C256-30ECAI
vs
27LV256-30/K
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROSS COMPONENTS
MICROCHIP TECHNOLOGY INC
Part Package Code
QFJ
QFJ
Package Description
0.450 X 0.550 INCH, CERAMIC, LCC-32
CERAMIC, LCC-32
Pin Count
32
32
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
300 ns
300 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-CQCC-N32
R-CQCC-N32
JESD-609 Code
e4
e0
Length
13.97 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
32KX8
32KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCN
QCCN
Package Equivalence Code
LCC32,.45X.55
LCC32,.45X.55
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
12.5 V
13 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.048 mm
Standby Current-Max
0.0003 A
0.0001 A
Supply Current-Max
0.025 mA
0.02 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
PALLADIUM GOLD
TIN LEAD
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
11.43 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
Compare AS27C256-30ECAI with alternatives
Compare 27LV256-30/K with alternatives