Datasheets
AM27C400-100DC by: AMD

UVPROM, 512KX8, 100ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40

Part Details for AM27C400-100DC by AMD

Overview of AM27C400-100DC by AMD

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Applications Computing and Data Storage Financial Technology (Fintech) Telecommunications

Part Details for AM27C400-100DC

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AM27C400-100DC Part Data Attributes:

AM27C400-100DC AMD
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AM27C400-100DC AMD UVPROM, 512KX8, 100ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Part Package Code DIP
Package Description WDIP, DIP40,.6
Pin Count 40
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 100 ns
Alternate Memory Width 16
I/O Type COMMON
JESD-30 Code R-CDIP-T40
JESD-609 Code e0
Length 52.2605 mm
Memory Density 4194304 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 40
Number of Words 524288 words
Number of Words Code 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 512KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code WDIP
Package Equivalence Code DIP40,.6
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.588 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.04 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for AM27C400-100DC

This table gives cross-reference parts and alternative options found for AM27C400-100DC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C400-100DC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
M27C400-100F1 256KX16 UVPROM, 100ns, CDIP40, FRIT SEALED, WINDOWED, CERAMIC, DIP-40 STMicroelectronics AM27C400-100DC vs M27C400-100F1
M5M27404AK-10 UVPROM, 512KX8, 100ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, GLASS SEALED, CERDIP-40 Mitsubishi Electric AM27C400-100DC vs M5M27404AK-10
Part Number Description Manufacturer Compare
AM27C040-125DC UVPROM, 512KX8, 120ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 AMD AM27C400-100DC vs AM27C040-125DC
HN27C4000G-15 512KX8 UVPROM, 150ns, CDIP40, 0.600 INCH, EIAJ, CERDIP-40 Renesas Electronics Corporation AM27C400-100DC vs HN27C4000G-15
CY27C040-120WI UVPROM, 512KX8, 120ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-32 Cypress Semiconductor AM27C400-100DC vs CY27C040-120WI
AM27C400-105DCB UVPROM, 512KX8, 100ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 AMD AM27C400-100DC vs AM27C400-105DCB
AM27C4096-125DCB UVPROM, 256KX16, 120ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 AMD AM27C400-100DC vs AM27C4096-125DCB
AM27C4096-105DCB UVPROM, 256KX16, 100ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 AMD AM27C400-100DC vs AM27C4096-105DCB
M27C4002-20XF1TR 256KX16 UVPROM, 200ns, CDIP40, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-40 STMicroelectronics AM27C400-100DC vs M27C4002-20XF1TR
AM27C4096-120DE UVPROM, 256KX16, 120ns, CMOS, CDIP40, CERAMIC, DIP-40 Spansion AM27C400-100DC vs AM27C4096-120DE
M27C4002-80XF6X 256KX16 UVPROM, 80ns, CDIP40, WINDOWED, FRIT SEALED, CERAMIC, DIP-40 STMicroelectronics AM27C400-100DC vs M27C4002-80XF6X
AM27C4096-105DCB UVPROM, 256KX16, 100ns, CMOS, CDIP40, CERAMIC, DIP-40 Spansion AM27C400-100DC vs AM27C4096-105DCB

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