Part Details for XQ7VX330T-L2RF1157E by AMD Xilinx
Overview of XQ7VX330T-L2RF1157E by AMD Xilinx
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Part Details for XQ7VX330T-L2RF1157E
XQ7VX330T-L2RF1157E CAD Models
XQ7VX330T-L2RF1157E Part Data Attributes
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XQ7VX330T-L2RF1157E
AMD Xilinx
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Datasheet
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XQ7VX330T-L2RF1157E
AMD Xilinx
Field Programmable Gate Array, 25500 CLBs, PBGA1157, 35 X 35 MM, 1 MM PITCH, FBGA-1157
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | 35 X 35 MM, 1 MM PITCH, FBGA-1157 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Clock Frequency-Max | 1818 MHz | |
| Combinatorial Delay of a CLB-Max | 0.61 ns | |
| JESD-30 Code | S-PBGA-B1157 | |
| JESD-609 Code | e0 | |
| Length | 35 mm | |
| Number of CLBs | 25500 | |
| Number of Inputs | 600 | |
| Number of Logic Cells | 326400 | |
| Number of Outputs | 600 | |
| Number of Terminals | 1157 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | ||
| Organization | 25500 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Seated Height-Max | 3.48 mm | |
| Supply Voltage-Max | 1.03 V | |
| Supply Voltage-Min | 0.97 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | HKMG | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 35 mm |