There are no models available for this part yet.
Overview of XPC860ZP33C1 by Freescale Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Industrial Automation
Renewable Energy
Robotics and Drones
CAD Models for XPC860ZP33C1 by Freescale Semiconductor
Part Data Attributes for XPC860ZP33C1 by Freescale Semiconductor
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|---|---|
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Part Life Cycle Code
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Obsolete
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Ihs Manufacturer
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FREESCALE SEMICONDUCTOR INC
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Part Package Code
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BGA
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Package Description
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PLASTIC, BGA-357
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Pin Count
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357
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Reach Compliance Code
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unknown
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ECCN Code
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5A991
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HTS Code
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8542.31.00.01
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Address Bus Width
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32
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Bit Size
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32
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Clock Frequency-Max
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33 MHz
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External Data Bus Width
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32
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JESD-30 Code
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S-PBGA-B357
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Length
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25 mm
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Number of Terminals
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357
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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BGA
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Package Shape
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SQUARE
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Package Style
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GRID ARRAY
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Qualification Status
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Not Qualified
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Seated Height-Max
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2.05 mm
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Speed
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33 MHz
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Supply Voltage-Max
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3.6 V
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Supply Voltage-Min
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3 V
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Supply Voltage-Nom
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3.3 V
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Surface Mount
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YES
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Technology
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CMOS
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Terminal Form
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BALL
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Terminal Pitch
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1.27 mm
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Terminal Position
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BOTTOM
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Width
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25 mm
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uPs/uCs/Peripheral ICs Type
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MICROPROCESSOR, RISC
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Alternate Parts for XPC860ZP33C1
This table gives cross-reference parts and alternative options found for XPC860ZP33C1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XPC860ZP33C1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TSXPC860SRMZPU40C1 | RISC Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | XPC860ZP33C1 vs TSXPC860SRMZPU40C1 |
| TS(X)PC860MHMGU40C | Microprocessor, 32-Bit, 40MHz, CMOS, CBGA357, CERAMIC, BGA-357 | Teledyne e2v | XPC860ZP33C1 vs TS(X)PC860MHMGU40C |
| TSPC860SRMZP40D | RISC Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Teledyne e2v | XPC860ZP33C1 vs TSPC860SRMZP40D |
| TSXPC860SRVZPU40B | RISC Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | XPC860ZP33C1 vs TSXPC860SRVZPU40B |
| TSPC860MHVGU/T50B | Microprocessor, 32-Bit, 50MHz, CMOS, CBGA357, CERAMIC, BGA-357 | Teledyne e2v | XPC860ZP33C1 vs TSPC860MHVGU/T50B |
| XPC860ENZP33C1 | RISC Microprocessor, 32-Bit, 33MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Motorola Semiconductor Products | XPC860ZP33C1 vs XPC860ENZP33C1 |
| TS(X)PC860MHMZPB/Q50C | Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Teledyne e2v | XPC860ZP33C1 vs TS(X)PC860MHMZPB/Q50C |
| MPC860ZP40 | RISC Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Motorola Semiconductor Products | XPC860ZP33C1 vs MPC860ZP40 |
| TSPC860MHMGB/Q50A3 | Microprocessor, 32-Bit, 50MHz, CMOS, CBGA357, CERAMIC, BGA-357 | Teledyne e2v | XPC860ZP33C1 vs TSPC860MHMGB/Q50A3 |
| TSPC860MHVGU40C | Microprocessor, 32-Bit, 40MHz, CMOS, CBGA357, CERAMIC, BGA-357 | Teledyne e2v | XPC860ZP33C1 vs TSPC860MHVGU40C |