Part Details for XPC860DCZP33 by Motorola Mobility LLC
Overview of XPC860DCZP33 by Motorola Mobility LLC
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Part Details for XPC860DCZP33
XPC860DCZP33 CAD Models
XPC860DCZP33 Part Data Attributes
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XPC860DCZP33
Motorola Mobility LLC
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Datasheet
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XPC860DCZP33
Motorola Mobility LLC
32-BIT, 33MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MOTOROLA INC | |
Part Package Code | BGA | |
Package Description | BGA, | |
Pin Count | 357 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Address Bus Width | 32 | |
Bit Size | 32 | |
Clock Frequency-Max | 33 MHz | |
External Data Bus Width | 32 | |
JESD-30 Code | S-PBGA-B357 | |
Length | 25 mm | |
Number of Terminals | 357 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.05 mm | |
Speed | 33 MHz | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 25 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for XPC860DCZP33
This table gives cross-reference parts and alternative options found for XPC860DCZP33. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XPC860DCZP33, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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TSPC860SRMZQU66D | RISC Microprocessor, 32-Bit, 66MHz, CMOS, PBGA357, 25 X 25 MM, 2.75 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-357 | Teledyne e2v | XPC860DCZP33 vs TSPC860SRMZQU66D |
TSPC860MHMGB/Q40A3 | Microprocessor, 32-Bit, 40MHz, CMOS, CBGA357, CERAMIC, BGA-357 | Teledyne e2v | XPC860DCZP33 vs TSPC860MHMGB/Q40A3 |
TSPC860MHMZPU40B | RISC Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Teledyne e2v | XPC860DCZP33 vs TSPC860MHMZPU40B |
XPC860ENZP50C1 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | XPC860DCZP33 vs XPC860ENZP50C1 |
TSPC860MHMZPU40A3 | Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Teledyne e2v | XPC860DCZP33 vs TSPC860MHMZPU40A3 |
MPC860SRCVR66D4 | 32-BIT, 66MHz, RISC PROCESSOR, PBGA357 | NXP Semiconductors | XPC860DCZP33 vs MPC860SRCVR66D4 |
MPC860SRCZQ66D4 | 32-BIT, 66MHz, RISC PROCESSOR, PBGA357 | NXP Semiconductors | XPC860DCZP33 vs MPC860SRCZQ66D4 |
TSPC860MHMGU/T50A3 | Microprocessor, 32-Bit, 50MHz, CMOS, CBGA357, CERAMIC, BGA-357 | Teledyne e2v | XPC860DCZP33 vs TSPC860MHMGU/T50A3 |
TSPC860MHMG50B | Microprocessor, 32-Bit, 50MHz, CMOS, CBGA357, CERAMIC, BGA-357 | Teledyne e2v | XPC860DCZP33 vs TSPC860MHMG50B |
TSPC860MHMZPB/Q50A3 | Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Teledyne e2v | XPC860DCZP33 vs TSPC860MHMZPB/Q50A3 |