There are no models available for this part yet.
Overview of XPC850DEZT66BU by Freescale Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 9 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for XPC850DEZT66BU by Freescale Semiconductor
Part Data Attributes for XPC850DEZT66BU by Freescale Semiconductor
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
FREESCALE SEMICONDUCTOR INC
|
Part Package Code
|
BGA
|
Package Description
|
BGA, BGA256,16X16,50
|
Pin Count
|
256
|
Reach Compliance Code
|
not_compliant
|
ECCN Code
|
5A991
|
HTS Code
|
8542.31.00.01
|
Address Bus Width
|
26
|
Bit Size
|
32
|
Boundary Scan
|
YES
|
Clock Frequency-Max
|
66 MHz
|
External Data Bus Width
|
32
|
Format
|
FIXED POINT
|
Integrated Cache
|
YES
|
JESD-30 Code
|
S-PBGA-B256
|
JESD-609 Code
|
e0
|
Length
|
23 mm
|
Low Power Mode
|
YES
|
Moisture Sensitivity Level
|
3
|
Number of Terminals
|
256
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
BGA
|
Package Equivalence Code
|
BGA256,16X16,50
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY
|
Peak Reflow Temperature (Cel)
|
225
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
2.35 mm
|
Speed
|
66 MHz
|
Supply Voltage-Max
|
3.465 V
|
Supply Voltage-Min
|
3.135 V
|
Supply Voltage-Nom
|
3.3 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Terminal Finish
|
Tin/Lead (Sn/Pb)
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1.27 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
Width
|
23 mm
|
uPs/uCs/Peripheral ICs Type
|
MICROPROCESSOR, RISC
|
Alternate Parts for XPC850DEZT66BU
This table gives cross-reference parts and alternative options found for XPC850DEZT66BU. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XPC850DEZT66BU, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
XPC850DECZT66BU | 32-BIT, 66MHz, RISC PROCESSOR, PBGA256, 23 X 23 MM, 1.22 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-256 | Freescale Semiconductor | XPC850DEZT66BU vs XPC850DECZT66BU |
XPC850CZT66BU | 32-BIT, 66MHz, RISC PROCESSOR, PBGA256, PLASTIC, BGA-256 | Motorola Mobility LLC | XPC850DEZT66BU vs XPC850CZT66BU |
XPC850ZT66B | 32-BIT, 66MHz, RISC PROCESSOR, PBGA256, PLASTIC, BGA-256 | Motorola Mobility LLC | XPC850DEZT66BU vs XPC850ZT66B |
XPC850SRCZT66BU | IC,MICROPROCESSOR,32-BIT,CMOS,BGA,256PIN,PLASTIC | Freescale Semiconductor | XPC850DEZT66BU vs XPC850SRCZT66BU |
XPC850ZT66BU | 32-BIT, 66MHz, RISC PROCESSOR, PBGA256, 23 X 23 MM, 1.22 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-256 | Freescale Semiconductor | XPC850DEZT66BU vs XPC850ZT66BU |
XPC850ZT66BU | 32-BIT, 66 MHz, RISC PROCESSOR, PBGA256, PLASTIC, BGA-256 | Motorola Mobility LLC | XPC850DEZT66BU vs XPC850ZT66BU |
XPC850DEZT66BU | 32-BIT, 66MHz, RISC PROCESSOR, PBGA256, PLASTIC, BGA-256 | Motorola Mobility LLC | XPC850DEZT66BU vs XPC850DEZT66BU |
XPC850DECZT66BU | 32-BIT, 66MHz, RISC PROCESSOR, PBGA256, PLASTIC, BGA-256 | Motorola Mobility LLC | XPC850DEZT66BU vs XPC850DECZT66BU |
XPC850CZT66BU | 32-BIT, 66MHz, RISC PROCESSOR, PBGA256, 23 X 23 MM, 1.22 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-256 | Freescale Semiconductor | XPC850DEZT66BU vs XPC850CZT66BU |
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