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Overview of XCZU5EV-3FBVB900E by AMD
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for XCZU5EV-3FBVB900E by AMD
Part Data Attributes for XCZU5EV-3FBVB900E by AMD
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---|---|
Rohs Code
|
Yes
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Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
ADVANCED MICRO DEVICES INC
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Package Description
|
FCBGA-900
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Reach Compliance Code
|
compliant
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JESD-30 Code
|
R-PBGA-B900
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JESD-609 Code
|
e1
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Moisture Sensitivity Level
|
4
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Number of Terminals
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900
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Operating Temperature-Max
|
100 °C
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Operating Temperature-Min
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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BGA
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Package Shape
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RECTANGULAR
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Package Style
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GRID ARRAY
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Peak Reflow Temperature (Cel)
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245
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Supply Voltage-Max
|
0.927 V
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Supply Voltage-Min
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0.873 V
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Supply Voltage-Nom
|
0.9 V
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
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OTHER
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Terminal Finish
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TIN SILVER COPPER
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Terminal Form
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BALL
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Terminal Position
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BOTTOM
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Time@Peak Reflow Temperature-Max (s)
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30
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uPs/uCs/Peripheral ICs Type
|
MICROPROCESSOR CIRCUIT
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