Datasheets
XC3S700A-4FGG484C by:

Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 667MHz, 13248-Cell, CMOS, PBGA484, FBGA-484

Part Details for XC3S700A-4FGG484C by AMD

Overview of XC3S700A-4FGG484C by AMD

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Price & Stock for XC3S700A-4FGG484C

Part # Distributor Description Stock Price Buy
DISTI # 122-1549-ND
DigiKey IC FPGA 372 I/O 484FBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray 155
In Stock
  • 1 $117.5000
$117.5000 Buy Now
DISTI # XC3S700A-4FGG484C
Avnet Asia FPGA Spartan-3A Family 700K Gates 13248 Cells 667MHz 90nm Technology 1.2V 484-Pin FBGA (Alt: XC3S700A-4FGG484C) RoHS: Compliant Min Qty: 1 Package Multiple: 1 5
RFQ

Part Details for XC3S700A-4FGG484C

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XC3S700A-4FGG484C Part Data Attributes

XC3S700A-4FGG484C AMD
Buy Now Datasheet
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XC3S700A-4FGG484C AMD Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 667MHz, 13248-Cell, CMOS, PBGA484, FBGA-484
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Package Description FBGA-484
Reach Compliance Code compliant
Samacsys Manufacturer AMD
Clock Frequency-Max 667 MHz
Combinatorial Delay of a CLB-Max 0.71 ns
JESD-30 Code S-PBGA-B484
JESD-609 Code e1
Length 23 mm
Moisture Sensitivity Level 3
Number of CLBs 1472
Number of Equivalent Gates 700000
Number of Inputs 372
Number of Logic Cells 13248
Number of Outputs 288
Number of Terminals 484
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 1472 CLBS, 700000 GATES
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA484,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 2.6 mm
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 23 mm

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