There are no models available for this part yet.
Overview of X28HC256EI-70T1 by Intersil Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 2 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Aerospace and Defense
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 70T15L17PF8 | Renesas Electronics Corporation | 8K X 9 ASYNC DP SRAM | |
| 70T15L25BFI | Renesas Electronics Corporation | 8K X 9 ASYNC DP SRAM | |
| 70T15S15PFI8 | Renesas Electronics Corporation | 8K X 9 ASYNC DP SRAM |
CAD Models for X28HC256EI-70T1 by Intersil Corporation
Part Data Attributes for X28HC256EI-70T1 by Intersil Corporation
|
|
|
|---|---|
|
Pbfree Code
|
No
|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
INTERSIL CORP
|
|
Part Package Code
|
QFJ
|
|
Package Description
|
QCCN,
|
|
Pin Count
|
32
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.51
|
|
Access Time-Max
|
70 ns
|
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Additional Feature
|
100000 ENDURANCE WRITE CYCLES; 100 YEARS DATA RETENTION
|
|
Data Retention Time-Min
|
100
|
|
Endurance
|
100000 Write/Erase Cycles
|
|
JESD-30 Code
|
R-CQCC-N32
|
|
Length
|
13.97 mm
|
|
Memory Density
|
262144 bit
|
|
Memory IC Type
|
EEPROM
|
|
Memory Width
|
8
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
32
|
|
Number of Words
|
32768 words
|
|
Number of Words Code
|
32000
|
|
Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Organization
|
32KX8
|
|
Package Body Material
|
CERAMIC, METAL-SEALED COFIRED
|
|
Package Code
|
QCCN
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
CHIP CARRIER
|
|
Parallel/Serial
|
PARALLEL
|
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
|
Programming Voltage
|
5 V
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
3.048 mm
|
|
Supply Voltage-Max (Vsup)
|
5.5 V
|
|
Supply Voltage-Min (Vsup)
|
4.5 V
|
|
Supply Voltage-Nom (Vsup)
|
5 V
|
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Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Form
|
NO LEAD
|
|
Terminal Pitch
|
1.27 mm
|
|
Terminal Position
|
QUAD
|
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
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Width
|
11.43 mm
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Write Cycle Time-Max (tWC)
|
5 ms
|
Alternate Parts for X28HC256EI-70T1
This table gives cross-reference parts and alternative options found for X28HC256EI-70T1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of X28HC256EI-70T1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| X28HC256E-70T1 | EEPROM, 32KX8, 70ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Xicor Inc | X28HC256EI-70T1 vs X28HC256E-70T1 |
| AT28HC256-70LC | EEPROM, 32KX8, 70ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Atmel Corporation | X28HC256EI-70T1 vs AT28HC256-70LC |
| X28VC256EM-70T1 | EEPROM, 32KX8, 70ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Xicor Inc | X28HC256EI-70T1 vs X28VC256EM-70T1 |
| LM28HC256-70 | EEPROM, 32KX8, 70ns, Parallel, CMOS, CQCC32 | LSI Corporation | X28HC256EI-70T1 vs LM28HC256-70 |
| PYA28HC256-70LMB | EEPROM, 32KX8, 70ns, Parallel, CMOS, CQCC32, 0.450 X 0.550 INCH, CERAMIC, LCC-32 | Pyramid Semiconductor Corporation | X28HC256EI-70T1 vs PYA28HC256-70LMB |
| LQ28HC256H-70 | EEPROM, 32KX8, 70ns, Parallel, CMOS, CQCC32 | LSI Corporation | X28HC256EI-70T1 vs LQ28HC256H-70 |
| PYA28HC256E-70LMB | EEPROM, 32KX8, 70ns, Parallel, CMOS, CQCC32, 0.450 X 0.550 INCH, CERAMIC, LCC-32 | Pyramid Semiconductor Corporation | X28HC256EI-70T1 vs PYA28HC256E-70LMB |
| 5962-8863405YX | EEPROM, 32KX8, 70ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Teledyne e2v | X28HC256EI-70T1 vs 5962-8863405YX |
| AT28HC256-70LJ | EEPROM, 32KX8, 70ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Atmel Corporation | X28HC256EI-70T1 vs AT28HC256-70LJ |
| 5962-8863405YX | EEPROM, 32KX8, 70ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | LSI Corporation | X28HC256EI-70T1 vs 5962-8863405YX |