X28HC256EI-70T1 vs PYA28HC256-70LMB feature comparison

X28HC256EI-70T1 Intersil Corporation

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PYA28HC256-70LMB Pyramid Semiconductor Corporation

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTERSIL CORP PYRAMID SEMICONDUCTOR CORP
Part Package Code QFJ QFJ
Package Description QCCN, 0.450 X 0.550 INCH, CERAMIC, LCC-32
Pin Count 32 32
Reach Compliance Code compliant compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 70 ns
Additional Feature 100000 ENDURANCE WRITE CYCLES; 100 YEARS DATA RETENTION
Data Retention Time-Min 100
Endurance 100000 Write/Erase Cycles
JESD-30 Code R-CQCC-N32 R-CQCC-N32
Length 13.97 mm 13.97 mm
Memory Density 262144 bit 262144 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 32KX8 32KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code QCCN QCCN
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.048 mm 1.905 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form NO LEAD NO LEAD
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 11.43 mm 11.43 mm
Write Cycle Time-Max (tWC) 5 ms 10 ms
Base Number Matches 1 2
Screening Level MIL-STD-883

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