There are no models available for this part yet.
Overview of X28C256EMB-35 by Xicor Inc
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for X28C256EMB-35 by Xicor Inc
Part Data Attributes for X28C256EMB-35 by Xicor Inc
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|
|
|---|---|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
XICOR INC
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|
Package Description
|
QCCN, LCC32,.45X.55
|
|
Reach Compliance Code
|
unknown
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|
Access Time-Max
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350 ns
|
|
Additional Feature
|
100000 ENDURANCE WRITE CYCLES; 100 YEARS DATA RETENTION
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Command User Interface
|
NO
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Data Polling
|
YES
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Data Retention Time-Min
|
100
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Endurance
|
100000 Write/Erase Cycles
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JESD-30 Code
|
R-CQCC-N32
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JESD-609 Code
|
e0
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Length
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13.97 mm
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Memory Density
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262144 bit
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Memory IC Type
|
EEPROM
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Memory Width
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8
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Number of Functions
|
1
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Number of Terminals
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32
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Number of Words
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32768 words
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Number of Words Code
|
32000
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Operating Mode
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ASYNCHRONOUS
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Operating Temperature-Max
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125 °C
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Operating Temperature-Min
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-55 °C
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Organization
|
32KX8
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Output Characteristics
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3-STATE
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Package Body Material
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CERAMIC, METAL-SEALED COFIRED
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Package Code
|
QCCN
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Package Equivalence Code
|
LCC32,.45X.55
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Package Shape
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RECTANGULAR
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Package Style
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CHIP CARRIER
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Page Size
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64 words
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Parallel/Serial
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PARALLEL
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Programming Voltage
|
5 V
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Qualification Status
|
Not Qualified
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Screening Level
|
MIL-STD-883
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Seated Height-Max
|
3.05 mm
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Standby Current-Max
|
0.0005 A
|
|
Supply Current-Max
|
0.06 mA
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Supply Voltage-Max (Vsup)
|
5.5 V
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Supply Voltage-Min (Vsup)
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4.5 V
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Supply Voltage-Nom (Vsup)
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5 V
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Surface Mount
|
YES
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Technology
|
CMOS
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Temperature Grade
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MILITARY
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Terminal Finish
|
TIN LEAD
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Terminal Form
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NO LEAD
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Terminal Pitch
|
1.27 mm
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Terminal Position
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QUAD
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Toggle Bit
|
YES
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Width
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11.43 mm
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Write Cycle Time-Max (tWC)
|
10 ms
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Alternate Parts for X28C256EMB-35
This table gives cross-reference parts and alternative options found for X28C256EMB-35. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of X28C256EMB-35, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 5962-8852509YA | EEPROM, 32KX8, 350ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Teledyne e2v | X28C256EMB-35 vs 5962-8852509YA |
| AM28C256-350LCB | EEPROM, 32KX8, 350ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | AMD | X28C256EMB-35 vs AM28C256-350LCB |
| X28C256EM-35 | EEPROM, 32KX8, 350ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Xicor Inc | X28C256EMB-35 vs X28C256EM-35 |
| X28256E-35 | EEPROM, 32KX8, 350ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 | Xicor Inc | X28C256EMB-35 vs X28256E-35 |
| 5962-8852501YX | EEPROM, 32KX8, 350ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Teledyne e2v | X28C256EMB-35 vs 5962-8852501YX |
| AM28C256-350LC | EEPROM, 32KX8, 350ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | AMD | X28C256EMB-35 vs AM28C256-350LC |
| 5962-8852509YX | EEPROM, 32KX8, 350ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Teledyne e2v | X28C256EMB-35 vs 5962-8852509YX |
| AT28C256E-35LM/883 | EEPROM, 32KX8, 350ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Atmel Corporation | X28C256EMB-35 vs AT28C256E-35LM/883 |
| 5962-8852509YC | EEPROM, 32KX8, 350ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Teledyne e2v | X28C256EMB-35 vs 5962-8852509YC |
| LE28C256-350 | EEPROM, 32KX8, 350ns, Parallel, CMOS, CQCC32 | LSI Corporation | X28C256EMB-35 vs LE28C256-350 |