There are no models available for this part yet.
Overview of WS512K8-120CC by Microsemi Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for WS512K8-120CC by Microsemi Corporation
Part Data Attributes for WS512K8-120CC by Microsemi Corporation
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|
|
|---|---|
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Part Life Cycle Code
|
Obsolete
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|
Ihs Manufacturer
|
MICROSEMI CORP
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Part Package Code
|
DIP
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Package Description
|
DIP,
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Pin Count
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32
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Reach Compliance Code
|
compliant
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ECCN Code
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3A991.B.2.A
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HTS Code
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8542.32.00.41
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Access Time-Max
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120 ns
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JESD-30 Code
|
R-CDIP-T32
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Length
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40.6 mm
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Memory Density
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4194304 bit
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Memory IC Type
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SRAM MODULE
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Memory Width
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8
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Number of Functions
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1
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Number of Terminals
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32
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Number of Words
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524288 words
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Number of Words Code
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512000
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Operating Mode
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ASYNCHRONOUS
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Operating Temperature-Max
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70 °C
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Operating Temperature-Min
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|
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Organization
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512KX8
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Package Body Material
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CERAMIC, METAL-SEALED COFIRED
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Package Code
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DIP
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Package Shape
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RECTANGULAR
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Package Style
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IN-LINE
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Parallel/Serial
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PARALLEL
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Qualification Status
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Not Qualified
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Seated Height-Max
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5.08 mm
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Supply Voltage-Max (Vsup)
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5.5 V
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Supply Voltage-Min (Vsup)
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4.5 V
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Supply Voltage-Nom (Vsup)
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5 V
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Surface Mount
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NO
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Technology
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CMOS
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Temperature Grade
|
COMMERCIAL
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Terminal Form
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THROUGH-HOLE
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Terminal Pitch
|
2.54 mm
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Terminal Position
|
DUAL
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Width
|
15.24 mm
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Alternate Parts for WS512K8-120CC
This table gives cross-reference parts and alternative options found for WS512K8-120CC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WS512K8-120CC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 5962-9561301HYA | Standard SRAM, 512KX8, 120ns, CMOS, CDIP32, CERAMIC, DIP-32 | White Microelectronics | WS512K8-120CC vs 5962-9561301HYA |
| DPS512S8P-12C | SRAM Module, 512KX8, 120ns, CMOS, CDMA32, 0.600 INCH, CERAMIC, SIDE BRAZED, DIP-32 | Force Technologies Ltd | WS512K8-120CC vs DPS512S8P-12C |
| EDI8M8512P120C6B | SRAM Module, 512KX8, 120ns, CMOS, | Electronic Designs Inc | WS512K8-120CC vs EDI8M8512P120C6B |
| WS512K8-120CCE | SRAM Module, 512KX8, 120ns, CMOS, CDMA32, | Microsemi Corporation | WS512K8-120CC vs WS512K8-120CCE |
| WS512K8-120CMEA | SRAM Module, 512KX8, 120ns, CMOS, CDMA32, SIDE BRAZED, CERAMIC, DIP-32 | Mercury Systems Inc | WS512K8-120CC vs WS512K8-120CMEA |
| WS512K8-120CQEA | SRAM Module, 512KX8, 120ns, CMOS, CDMA32, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | WS512K8-120CC vs WS512K8-120CQEA |
| WMS512K8-120CQ | Standard SRAM, 512KX8, 120ns, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Mercury Systems Inc | WS512K8-120CC vs WMS512K8-120CQ |
| 5962-9561301HYC | Standard SRAM, 512KX8, 120ns, CMOS, CDIP32, CERAMIC, DIP-32 | White Microelectronics | WS512K8-120CC vs 5962-9561301HYC |
| DPS512S8N-12C | SRAM Module, 512KX8, 120ns, CMOS, CDMA32, SIDE BRAZED, CERAMIC PACKAGE-32 | Twilight Technology Inc | WS512K8-120CC vs DPS512S8N-12C |
| 5962-9561301HYC | Standard SRAM, 512KX8, 120ns, CMOS, CDIP32, CERAMIC, DIP-32 | Mercury Systems Inc | WS512K8-120CC vs 5962-9561301HYC |