Part Details for WS1M8-100CCA by Microsemi Corporation
Overview of WS1M8-100CCA by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Audio and Video Systems
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| R5F100CCALA#W0 | Renesas Electronics Corporation | Low Power, High Function Microcontrollers for General Purpose Applications | |
| R5F100CCALA#U0 | Renesas Electronics Corporation | Low Power, High Function Microcontrollers for General Purpose Applications |
Part Details for WS1M8-100CCA
WS1M8-100CCA CAD Models
WS1M8-100CCA Part Data Attributes
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WS1M8-100CCA
Microsemi Corporation
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Datasheet
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WS1M8-100CCA
Microsemi Corporation
Standard SRAM, 1MX8, 100ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 100 ns | |
| JESD-30 Code | R-CDIP-T32 | |
| JESD-609 Code | e0 | |
| Memory Density | 8388608 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 1MX8 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.13 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Position | DUAL |
Alternate Parts for WS1M8-100CCA
This table gives cross-reference parts and alternative options found for WS1M8-100CCA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WS1M8-100CCA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| WS1M8V-35CMA | Standard SRAM, 1MX8, 35ns, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | WS1M8-100CCA vs WS1M8V-35CMA |
| DPS1MX8MKN3-25CA | Standard SRAM, 1MX8, 25ns, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, CERAMIC, SLCC, DIP-32 | B&B Electronics Manufacturing Company | WS1M8-100CCA vs DPS1MX8MKN3-25CA |
| WS1M8-45CC | Standard SRAM, 1MX8, 45ns, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | WS1M8-100CCA vs WS1M8-45CC |
| WS1M8V-100CC | Standard SRAM, 1MX8, 100ns, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | WS1M8-100CCA vs WS1M8V-100CC |
| WS1M8V-17CI | Standard SRAM, 1MX8, 17ns, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | WS1M8-100CCA vs WS1M8V-17CI |
| WS1M8-55CI | Standard SRAM, 1MX8, 55ns, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | WS1M8-100CCA vs WS1M8-55CI |
| DPS1MS8MP-70I | SRAM Module, 1MX8, 70ns, CMOS, CDMA32, 0.600 INCH, DIP-32 | Twilight Technology Inc | WS1M8-100CCA vs DPS1MS8MP-70I |
| WS1M8-25CC | Standard SRAM, 1MX8, 25ns, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | WS1M8-100CCA vs WS1M8-25CC |
| WS1M8L-55CC | Standard SRAM, 1MX8, 55ns, CMOS, CDIP32, SIDE BRAZED, CERAMIC, DIP-32 | White Microelectronics | WS1M8-100CCA vs WS1M8L-55CC |
| WS1M8-17CI | Standard SRAM, 1MX8, 17ns, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | Microsemi Corporation | WS1M8-100CCA vs WS1M8-17CI |