Part Details for WF2M32BI-90HI5A by White Electronic Designs Corp
Overview of WF2M32BI-90HI5A by White Electronic Designs Corp
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Part Details for WF2M32BI-90HI5A
WF2M32BI-90HI5A CAD Models
WF2M32BI-90HI5A Part Data Attributes
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WF2M32BI-90HI5A
White Electronic Designs Corp
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WF2M32BI-90HI5A
White Electronic Designs Corp
Flash Module, 8MX8, 90ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | WHITE ELECTRONIC DESIGNS CORP | |
| Package Description | 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Category CO2 Kg | 12 | |
| Compliance Temperature Grade | Industrial: -40C to +85C | |
| Access Time-Max | 90 ns | |
| Additional Feature | USER CONFIGURABLE AS 4M X 16 OR 2M X 32; 100000 WRITE/ERASE CYCLES MIN | |
| JESD-30 Code | S-CPGA-P66 | |
| JESD-609 Code | e0 | |
| Length | 30.1 mm | |
| Memory Density | 67108864 bit | |
| Memory IC Type | FLASH MODULE | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 66 | |
| Number of Words | 8388608 words | |
| Number of Words Code | 8000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 8MX8 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | PGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 5 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 6.22 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Type | NOR TYPE | |
| Width | 30.1 mm |