Part Details for W97AH2KBQX2I by Winbond Electronics Corp
Overview of W97AH2KBQX2I by Winbond Electronics Corp
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (6 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Price & Stock for W97AH2KBQX2I
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
454-W97AH2KBQX2I
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Mouser Electronics | DRAM 1Gb LPDDR2, x32, 400MHz, -40 ~ 85C RoHS: Compliant | 0 |
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Order Now | |
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NAC | 1Gb LPDDR2, x32, 400MHz, -40 ~ 85C, PoP (WFBGA) 168 Package RoHS: Compliant Min Qty: 168 Package Multiple: 168 | 0 |
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RFQ |
Part Details for W97AH2KBQX2I
W97AH2KBQX2I CAD Models
W97AH2KBQX2I Part Data Attributes
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W97AH2KBQX2I
Winbond Electronics Corp
Buy Now
Datasheet
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W97AH2KBQX2I
Winbond Electronics Corp
DDR DRAM, 32MX32, CMOS, PBGA168, WFBGA-168
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Package Description | WFBGA-168 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.32 | |
| Samacsys Manufacturer | Winbond | |
| Access Mode | MULTI BANK PAGE BURST | |
| Additional Feature | SELF REFRESH; IT ALSO REQUIRES 1.8V NOM | |
| JESD-30 Code | S-PBGA-B168 | |
| Length | 12 mm | |
| Memory Density | 1073741824 bit | |
| Memory IC Type | DDR DRAM | |
| Memory Width | 32 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 168 | |
| Number of Words | 33554432 words | |
| Number of Words Code | 32000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 32MX32 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 0.8 mm | |
| Self Refresh | YES | |
| Supply Voltage-Max (Vsup) | 1.3 V | |
| Supply Voltage-Min (Vsup) | 1.14 V | |
| Supply Voltage-Nom (Vsup) | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 12 mm |
Alternate Parts for W97AH2KBQX2I
This table gives cross-reference parts and alternative options found for W97AH2KBQX2I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W97AH2KBQX2I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| EDB1332BDBH-1DAAT-F-R | DDR DRAM, 32MX32, CMOS, PBGA134, VFBGA-134 | Micron Technology Inc | W97AH2KBQX2I vs EDB1332BDBH-1DAAT-F-R |
| EDB1332BDBH-1DAAT-F-D | DDR DRAM, 32MX32, CMOS, PBGA134, VFBGA-134 | Micron Technology Inc | W97AH2KBQX2I vs EDB1332BDBH-1DAAT-F-D |
| W97AH2KBQX2E | DDR DRAM, 32MX32, CMOS, PBGA168, WFBGA-168 | Winbond Electronics Corp | W97AH2KBQX2I vs W97AH2KBQX2E |
| W97AH2KBVX2E | DDR DRAM, 32MX32, CMOS, PBGA134, VFBGA-134 | Winbond Electronics Corp | W97AH2KBQX2I vs W97AH2KBVX2E |
| MT42L32M32D1HE-18AUT:D | DRAM, | Micron Technology Inc | W97AH2KBQX2I vs MT42L32M32D1HE-18AUT:D |
| EDB1332BDBH-1DAAT-F | DDR DRAM, 32MX32, CMOS, PBGA134, FBGA-134 | Micron Technology Inc | W97AH2KBQX2I vs EDB1332BDBH-1DAAT-F |