W97AH2KBQX2I
vs
EDB1332BDBH-1DAAT-F-D
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
WINBOND ELECTRONICS CORP
MICRON TECHNOLOGY INC
Package Description
WFBGA-168
VFBGA,
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.32
8542.32.00.32
Samacsys Manufacturer
Winbond
Micron
Access Mode
MULTI BANK PAGE BURST
MULTI BANK PAGE BURST
Additional Feature
SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
JESD-30 Code
S-PBGA-B168
R-PBGA-B134
Length
12 mm
11.5 mm
Memory Density
1073741824 bit
1073741824 bit
Memory IC Type
DDR DRAM
LPDDR2 DRAM
Memory Width
32
32
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
168
134
Number of Words
33554432 words
33554432 words
Number of Words Code
32000000
32000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
32MX32
32MX32
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
VFBGA
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
0.8 mm
1 mm
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
1.3 V
1.3 V
Supply Voltage-Min (Vsup)
1.14 V
1.14 V
Supply Voltage-Nom (Vsup)
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.5 mm
0.65 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
12 mm
10 mm
Base Number Matches
1
1
Date Of Intro
2016-05-12
JESD-609 Code
e1
Terminal Finish
TIN SILVER COPPER
Compare W97AH2KBQX2I with alternatives
Compare EDB1332BDBH-1DAAT-F-D with alternatives