Memory
W948D2FBJX5E
Winbond Electronics Corp
Description: DDR DRAM, 4MX32, 5ns, CMOS, PBGA90, 8 X 13 MM, 0.80 MM PITCH, HALOGEN FREE AND LEAD FREE, VFBGA-90

Overview of W948D2FBJX5E by Winbond Electronics Corp

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Price & Stock for W948D2FBJX5E by Winbond Electronics Corp

Part # Manufacturer Description Stock Price Buy
DISTI # W948D2FBJX5E-ND
DigiKey IC DRAM 256MBIT PAR 90VFBGA Min Qty: 1 Lead time: 28 Weeks Container: Tray 140
In Stock
  • 1 $5.3700
  • 10 $3.9520
  • 25 $3.5984
  • 40 $3.4493
  • 80 $3.2622
$3.2622 / $5.3700 Buy Now
NAC 256Mb LPDDR, x32, 200MHz, VFBGA90 Package RoHS: Compliant Package Multiple: 1 0
RFQ

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Part Data Attributes for W948D2FBJX5E by Winbond Electronics Corp

W948D2FBJX5E
Winbond Electronics Corp
-
-
Rohs Code
Yes
Part Life Cycle Code
Not Recommended
Ihs Manufacturer
WINBOND ELECTRONICS CORP
Part Package Code
BGA
Package Description
8 X 13 MM, 0.80 MM PITCH, HALOGEN FREE AND LEAD FREE, VFBGA-90
Pin Count
90
Reach Compliance Code
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.02
Samacsys Manufacturer
Winbond
Access Mode
FOUR BANK PAGE BURST
Access Time-Max
5 ns
Additional Feature
AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)
200 MHz
I/O Type
COMMON
Interleaved Burst Length
2,4,8,16
JESD-30 Code
R-PBGA-B90
Length
13 mm
Memory Density
134217728 bit
Memory IC Type
LPDDR1 DRAM
Memory Width
32
Number of Functions
1
Number of Ports
1
Number of Terminals
90
Number of Words
4194304 words
Number of Words Code
4000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-25 °C
Organization
4MX32
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
TFBGA
Package Equivalence Code
BGA90,9X15,32
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Refresh Cycles
4096
Seated Height-Max
1.025 mm
Self Refresh
YES
Sequential Burst Length
2,4,8,16
Standby Current-Max
0.00001 A
Supply Current-Max
0.075 mA
Supply Voltage-Max (Vsup)
1.95 V
Supply Voltage-Min (Vsup)
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
OTHER
Terminal Form
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
8 mm
Want to compare parts?
  1. W948D2FBJX5E
    Winbond Electronics Corp
    DDR DRAM, 4MX32, 5ns, CMOS, PBGA90, 8 X 13 MM, 0.80 MM PITCH, HALOGEN FREE AND LEAD FREE, VFBGA-90
    VS

Alternate Parts for W948D2FBJX5E

This table gives cross-reference parts and alternative options found for W948D2FBJX5E. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W948D2FBJX5E, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
W987D2HBJX7G Synchronous DRAM, 4MX32, 5.4ns, CMOS, PBGA90, VFBGA-90 Winbond Electronics Corp W948D2FBJX5E vs W987D2HBJX7G
W947D2HBJX5I DDR DRAM, 4MX32, 5ns, CMOS, PBGA90, 8 X 13 MM, 0.80 MM PITCH, HALOGEN FREE AND LEAD FREE, VFBGA-90 Winbond Electronics Corp W948D2FBJX5E vs W947D2HBJX5I
W948D2FBJX6E DDR DRAM, 4MX32, 5ns, CMOS, PBGA90, 8 X 13 MM, 0.80 MM PITCH, HALOGEN FREE AND LEAD FREE, VFBGA-90 Winbond Electronics Corp W948D2FBJX5E vs W948D2FBJX6E
W988D2FBJX7E Synchronous DRAM, 8MX32, 5.4ns, CMOS, PBGA90, 8 X 13 MM, 0.80 MM PITCH, HALOGEN AND LEAD FREE, VFBGA-90 Winbond Electronics Corp W948D2FBJX5E vs W988D2FBJX7E
W947D2HBJX6G DDR DRAM, 4MX32, 5ns, CMOS, PBGA90, 8 X 13 MM, 0.80 MM PITCH, HALOGEN FREE AND LEAD FREE, VFBGA-90 Winbond Electronics Corp W948D2FBJX5E vs W947D2HBJX6G
W988D2FBJX7G Synchronous DRAM, 8MX32, 5.4ns, CMOS, PBGA90, 8 X 13 MM, 0.80 MM PITCH, HALOGEN AND LEAD FREE, VFBGA-90 Winbond Electronics Corp W948D2FBJX5E vs W988D2FBJX7G
W948D2FBJX6G DDR DRAM, 4MX32, 5ns, CMOS, PBGA90, 8 X 13 MM, 0.80 MM PITCH, HALOGEN FREE AND LEAD FREE, VFBGA-90 Winbond Electronics Corp W948D2FBJX5E vs W948D2FBJX6G
W988D2FBJX6E Synchronous DRAM, 8MX32, 5.4ns, CMOS, PBGA90, 8 X 13 MM, 0.80 MM PITCH, HALOGEN AND LEAD FREE, VFBGA-90 Winbond Electronics Corp W948D2FBJX5E vs W988D2FBJX6E
W987D2HBJX7E Synchronous DRAM, 4MX32, 5.4ns, CMOS, PBGA90, VFBGA-90 Winbond Electronics Corp W948D2FBJX5E vs W987D2HBJX7E
W947D2HBJX6E DDR DRAM, 4MX32, 5ns, CMOS, PBGA90, 8 X 13 MM, 0.80 MM PITCH, HALOGEN FREE AND LEAD FREE, VFBGA-90 Winbond Electronics Corp W948D2FBJX5E vs W947D2HBJX6E

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