There are no models available for this part yet.
Overview of W988D2FBJX7G by Winbond Electronics Corp
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
CAD Models for W988D2FBJX7G by Winbond Electronics Corp
Part Data Attributes for W988D2FBJX7G by Winbond Electronics Corp
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|---|---|
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Rohs Code
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Yes
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Part Life Cycle Code
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Not Recommended
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Ihs Manufacturer
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WINBOND ELECTRONICS CORP
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Part Package Code
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BGA
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Package Description
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8 X 13 MM, 0.80 MM PITCH, HALOGEN AND LEAD FREE, VFBGA-90
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Pin Count
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90
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Reach Compliance Code
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compliant
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ECCN Code
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EAR99
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HTS Code
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8542.32.00.24
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Access Mode
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FOUR BANK PAGE BURST
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Access Time-Max
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5.4 ns
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Additional Feature
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AUTO/SELF REFRESH
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Alternate Memory Width
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16
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Clock Frequency-Max (fCLK)
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133 MHz
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I/O Type
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COMMON
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Interleaved Burst Length
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1,2,4,8
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JESD-30 Code
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R-PBGA-B90
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Length
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13 mm
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Memory Density
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268435456 bit
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Memory IC Type
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SYNCHRONOUS DRAM
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Memory Width
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32
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Number of Functions
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1
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Number of Ports
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1
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Number of Terminals
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90
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Number of Words
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8388608 words
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Number of Words Code
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8000000
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Operating Mode
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SYNCHRONOUS
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Operating Temperature-Max
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85 °C
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Operating Temperature-Min
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-25 °C
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Organization
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8MX32
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Output Characteristics
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3-STATE
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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TFBGA
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Package Equivalence Code
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BGA90,9X15,32
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Package Shape
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RECTANGULAR
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Package Style
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GRID ARRAY, THIN PROFILE, FINE PITCH
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Peak Reflow Temperature (Cel)
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NOT SPECIFIED
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Qualification Status
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Not Qualified
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Refresh Cycles
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4096
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Seated Height-Max
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1.025 mm
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Self Refresh
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YES
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Sequential Burst Length
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1,2,4,8,FP
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Standby Current-Max
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0.00001 A
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Supply Current-Max
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0.07 mA
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Supply Voltage-Max (Vsup)
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1.95 V
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Supply Voltage-Min (Vsup)
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1.7 V
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Supply Voltage-Nom (Vsup)
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1.8 V
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
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OTHER
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Terminal Form
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BALL
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Terminal Pitch
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0.8 mm
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Terminal Position
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BOTTOM
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Time@Peak Reflow Temperature-Max (s)
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NOT SPECIFIED
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Width
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8 mm
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Alternate Parts for W988D2FBJX7G
This table gives cross-reference parts and alternative options found for W988D2FBJX7G. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W988D2FBJX7G, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| W987D2HBJX7G | Synchronous DRAM, 4MX32, 5.4ns, CMOS, PBGA90, VFBGA-90 | Winbond Electronics Corp | W988D2FBJX7G vs W987D2HBJX7G |
| W947D2HBJX5I | DDR DRAM, 4MX32, 5ns, CMOS, PBGA90, 8 X 13 MM, 0.80 MM PITCH, HALOGEN FREE AND LEAD FREE, VFBGA-90 | Winbond Electronics Corp | W988D2FBJX7G vs W947D2HBJX5I |
| W948D2FBJX5E | DDR DRAM, 4MX32, 5ns, CMOS, PBGA90, 8 X 13 MM, 0.80 MM PITCH, HALOGEN FREE AND LEAD FREE, VFBGA-90 | Winbond Electronics Corp | W988D2FBJX7G vs W948D2FBJX5E |
| W948D2FBJX6E | DDR DRAM, 4MX32, 5ns, CMOS, PBGA90, 8 X 13 MM, 0.80 MM PITCH, HALOGEN FREE AND LEAD FREE, VFBGA-90 | Winbond Electronics Corp | W988D2FBJX7G vs W948D2FBJX6E |
| W988D2FBJX7E | Synchronous DRAM, 8MX32, 5.4ns, CMOS, PBGA90, 8 X 13 MM, 0.80 MM PITCH, HALOGEN AND LEAD FREE, VFBGA-90 | Winbond Electronics Corp | W988D2FBJX7G vs W988D2FBJX7E |
| W947D2HBJX6G | DDR DRAM, 4MX32, 5ns, CMOS, PBGA90, 8 X 13 MM, 0.80 MM PITCH, HALOGEN FREE AND LEAD FREE, VFBGA-90 | Winbond Electronics Corp | W988D2FBJX7G vs W947D2HBJX6G |
| W948D2FBJX6G | DDR DRAM, 4MX32, 5ns, CMOS, PBGA90, 8 X 13 MM, 0.80 MM PITCH, HALOGEN FREE AND LEAD FREE, VFBGA-90 | Winbond Electronics Corp | W988D2FBJX7G vs W948D2FBJX6G |
| W988D2FBJX6E | Synchronous DRAM, 8MX32, 5.4ns, CMOS, PBGA90, 8 X 13 MM, 0.80 MM PITCH, HALOGEN AND LEAD FREE, VFBGA-90 | Winbond Electronics Corp | W988D2FBJX7G vs W988D2FBJX6E |
| W987D2HBJX7E | Synchronous DRAM, 4MX32, 5.4ns, CMOS, PBGA90, VFBGA-90 | Winbond Electronics Corp | W988D2FBJX7G vs W987D2HBJX7E |
| W947D2HBJX6E | DDR DRAM, 4MX32, 5ns, CMOS, PBGA90, 8 X 13 MM, 0.80 MM PITCH, HALOGEN FREE AND LEAD FREE, VFBGA-90 | Winbond Electronics Corp | W988D2FBJX7G vs W947D2HBJX6E |