Part Details for W3EG7266S265D3S by Microsemi Corporation
Overview of W3EG7266S265D3S by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Internet of Things (IoT)
Environmental Monitoring
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Part Details for W3EG7266S265D3S
W3EG7266S265D3S CAD Models
W3EG7266S265D3S Part Data Attributes
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W3EG7266S265D3S
Microsemi Corporation
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Datasheet
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W3EG7266S265D3S
Microsemi Corporation
DDR DRAM Module, 64MX72, 0.75ns, CMOS, DIMM-184
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MICROSEMI CORP | |
Part Package Code | DIMM | |
Package Description | DIMM, | |
Pin Count | 184 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.36 | |
Access Mode | FOUR BANK PAGE BURST | |
Access Time-Max | 0.75 ns | |
Additional Feature | AUTO/SELF REFRESH | |
JESD-30 Code | R-XDMA-N184 | |
Memory Density | 4831838208 bit | |
Memory IC Type | DDR DRAM MODULE | |
Memory Width | 72 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 184 | |
Number of Words | 67108864 words | |
Number of Words Code | 64000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 64MX72 | |
Package Body Material | UNSPECIFIED | |
Package Code | DIMM | |
Package Shape | RECTANGULAR | |
Package Style | MICROELECTRONIC ASSEMBLY | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Self Refresh | YES | |
Supply Voltage-Max (Vsup) | 2.7 V | |
Supply Voltage-Min (Vsup) | 2.3 V | |
Supply Voltage-Nom (Vsup) | 2.5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | NO LEAD | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Alternate Parts for W3EG7266S265D3S
This table gives cross-reference parts and alternative options found for W3EG7266S265D3S. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W3EG7266S265D3S, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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M381L6423ETM-LC4 | DDR DRAM Module, 64MX72, 0.65ns, CMOS, DIMM-184 | Samsung Semiconductor | W3EG7266S265D3S vs M381L6423ETM-LC4 |
HYMD264726D8-K | DDR DRAM Module, 64MX8, 0.75ns, CMOS, DIMM-184 | SK Hynix Inc | W3EG7266S265D3S vs HYMD264726D8-K |
HYS72D64301HBR-6-C | DDR DRAM Module, 64MX72, 0.7ns, CMOS, GREEN, RDIMM-184 | Qimonda AG | W3EG7266S265D3S vs HYS72D64301HBR-6-C |
MT18VDDT6472LAY-202XX | DDR DRAM Module, 64MX72, 0.8ns, CMOS, MO-206, DIMM-184 | Micron Technology Inc | W3EG7266S265D3S vs MT18VDDT6472LAY-202XX |
M381L6423AT0-LA2 | DDR DRAM Module, 64MX72, 0.75ns, CMOS, DIMM-184 | Samsung Semiconductor | W3EG7266S265D3S vs M381L6423AT0-LA2 |
MT18VDDT6472DIG-202XX | DDR DRAM Module, 64MX72, 0.8ns, CMOS, DIMM-184 | Micron Technology Inc | W3EG7266S265D3S vs MT18VDDT6472DIG-202XX |
W3EG7262S202JD3MG | DDR DRAM Module, 64MX72, 0.75ns, CMOS, ROHS COMPLIANT, DIMM-184 | Microsemi Corporation | W3EG7266S265D3S vs W3EG7262S202JD3MG |
M312L6420BT0-CA0 | DDR DRAM Module, 64MX72, 0.8ns, CMOS, DIMM-184 | Samsung Semiconductor | W3EG7266S265D3S vs M312L6420BT0-CA0 |
MT18VDDT6472AY-335 | DDR DRAM Module, 64MX72, 0.7ns, CMOS, PDMA184 | Micron Technology Inc | W3EG7266S265D3S vs MT18VDDT6472AY-335 |
V827464K24SAEW-A1 | DDR DRAM Module, 64MX72, 0.8ns, CMOS, LEAD FREE, DIMM-184 | ProMOS Technologies Inc | W3EG7266S265D3S vs V827464K24SAEW-A1 |