There are no models available for this part yet.
Overview of W25Q80BVSSJP by Winbond Electronics Corp
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 6 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
CAD Models for W25Q80BVSSJP by Winbond Electronics Corp
Part Data Attributes for W25Q80BVSSJP by Winbond Electronics Corp
|
|
|
|---|---|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
WINBOND ELECTRONICS CORP
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|
Package Description
|
SOIC-8
|
|
Reach Compliance Code
|
unknown
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|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.51
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|
Clock Frequency-Max (fCLK)
|
104 MHz
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|
JESD-30 Code
|
S-PDSO-G8
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|
Length
|
5.23 mm
|
|
Memory Density
|
8388608 bit
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Memory IC Type
|
FLASH
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Memory Width
|
8
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Number of Functions
|
1
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Number of Terminals
|
8
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Number of Words
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1048576 words
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Number of Words Code
|
1000000
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Operating Mode
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SYNCHRONOUS
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|
Operating Temperature-Max
|
105 °C
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|
Operating Temperature-Min
|
-40 °C
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|
Organization
|
1MX8
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Output Characteristics
|
3-STATE
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Package Body Material
|
PLASTIC/EPOXY
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|
Package Code
|
SOP
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Package Shape
|
SQUARE
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|
Package Style
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SMALL OUTLINE
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|
Parallel/Serial
|
SERIAL
|
|
Programming Voltage
|
3 V
|
|
Screening Level
|
AEC-Q100
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|
Seated Height-Max
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2.16 mm
|
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Supply Voltage-Max (Vsup)
|
3.6 V
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|
Supply Voltage-Min (Vsup)
|
2.7 V
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|
Supply Voltage-Nom (Vsup)
|
3 V
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Surface Mount
|
YES
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Technology
|
CMOS
|
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Temperature Grade
|
INDUSTRIAL
|
|
Terminal Form
|
GULL WING
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|
Terminal Pitch
|
1.27 mm
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|
Terminal Position
|
DUAL
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|
Width
|
5.23 mm
|
Alternate Parts for W25Q80BVSSJP
This table gives cross-reference parts and alternative options found for W25Q80BVSSJP. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W25Q80BVSSJP, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| W25Q80BVSSIG | Flash, 8MX1, PDSO8, 0.208 INCH, GREEN, PLASTIC, SOIC-8 | Winbond Electronics Corp | W25Q80BVSSJP vs W25Q80BVSSIG |
| W25Q80BVSSAP | Flash, 8MX1, PDSO8, 0.208 INCH, GREEN, PLASTIC, SOIC-8 | Winbond Electronics Corp | W25Q80BVSSJP vs W25Q80BVSSAP |
| W25Q80BVSSIP | Flash, 8MX1, PDSO8, 0.208 INCH, GREEN, PLASTIC, SOIC-8 | Winbond Electronics Corp | W25Q80BVSSJP vs W25Q80BVSSIP |
| W25Q80BVSSBP | Flash, 1MX8, PDSO8, SOIC-8 | Winbond Electronics Corp | W25Q80BVSSJP vs W25Q80BVSSBP |
| W25Q80BVSSAG | Flash, 8MX1, PDSO8, 0.208 INCH, GREEN, PLASTIC, SOIC-8 | Winbond Electronics Corp | W25Q80BVSSJP vs W25Q80BVSSAG |
| W25Q80BVSSBG | Flash, 1MX8, PDSO8, SOIC-8 | Winbond Electronics Corp | W25Q80BVSSJP vs W25Q80BVSSBG |