Datasheets
W25Q64JVXGIM by: Winbond Electronics Corp

Flash, 8MX8, PDSO8, XSON-8

Part Details for W25Q64JVXGIM by Winbond Electronics Corp

Overview of W25Q64JVXGIM by Winbond Electronics Corp

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Part Details for W25Q64JVXGIM

W25Q64JVXGIM CAD Models

W25Q64JVXGIM Part Data Attributes

W25Q64JVXGIM Winbond Electronics Corp
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W25Q64JVXGIM Winbond Electronics Corp Flash, 8MX8, PDSO8, XSON-8
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer WINBOND ELECTRONICS CORP
Package Description XSON-8
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Date Of Intro 2017-05-24
Samacsys Manufacturer Winbond
Additional Feature IT ALSO OPERATES AT 2.7V @ 104MHZ
Alternate Memory Width 1
Clock Frequency-Max (fCLK) 133 MHz
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
JESD-30 Code S-PDSO-N8
Length 4 mm
Memory Density 67108864 bit
Memory IC Type FLASH
Memory Width 8
Number of Functions 1
Number of Terminals 8
Number of Words 8388608 words
Number of Words Code 8000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 8MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code HVSON
Package Equivalence Code SOLCC8,.16,32
Package Shape SQUARE
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 3 V
Seated Height-Max 0.5 mm
Serial Bus Type SPI
Standby Current-Max 0.00005 A
Supply Current-Max 0.025 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form NO LEAD
Terminal Pitch 0.8 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type NOR TYPE
Width 4 mm
Write Protection HARDWARE/SOFTWARE

Alternate Parts for W25Q64JVXGIM

This table gives cross-reference parts and alternative options found for W25Q64JVXGIM. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W25Q64JVXGIM, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
M25PX64SOVZM3EB Flash, 8MX8, PBGA24, 6 X 8 MM, ROHS COMPLIANT, TBGA-24 Micron Technology Inc W25Q64JVXGIM vs M25PX64SOVZM3EB
W25Q64FVDAIG Flash, 64MX1, PDIP8, DIP-8 Winbond Electronics Corp W25Q64JVXGIM vs W25Q64FVDAIG
W25Q64JVSSIQT Flash, 8MX8, PDSO8, SOIC-8 Winbond Electronics Corp W25Q64JVXGIM vs W25Q64JVSSIQT
M25PX64STVME6P EEPROM, 8MX8, Serial, CMOS, PDSO8, 8 X 6 MM, ROHS COMPLIANT, VDFPN-8 Numonyx Memory Solutions W25Q64JVXGIM vs M25PX64STVME6P
M25PX64SVMF6G EEPROM, 8MX8, Serial, CMOS, PDSO16, 0.300 INCH, ROHS COMPLIANT, PLASTIC, SOP-16 Numonyx Memory Solutions W25Q64JVXGIM vs M25PX64SVMF6G
M25PX64SOVMF3T Flash, 8MX8, PDSO16, 0.300 INCH, ROHS COMPLIANT, SOP-16 Micron Technology Inc W25Q64JVXGIM vs M25PX64SOVMF3T
M25PX64SVMF6E Flash, 8MX8, PDSO16, SOP-16 Numonyx Memory Solutions W25Q64JVXGIM vs M25PX64SVMF6E
M25PX64SVMF6EA Flash, 8MX8, PDSO16, 0.300 INCH, ROHS COMPLIANT, SOP-16 Micron Technology Inc W25Q64JVXGIM vs M25PX64SVMF6EA
M25PX64-VMF6EBA Flash, 8MX8, PDSO16, 0.300 INCH, ROHS COMPLIANT, SOP-16 Micron Technology Inc W25Q64JVXGIM vs M25PX64-VMF6EBA
M25PX64SOVZM6TBA Flash, 8MX8, PBGA24, 6 X 8 MM, ROHS COMPLIANT, TBGA-24 Micron Technology Inc W25Q64JVXGIM vs M25PX64SOVZM6TBA

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